Hello SI and PI Enthusiasts,
I am excited to be participating in an EPEPS tutorial with my colleagues
Michael Hill from Intel and Wui-Weng Wong from AMD to discuss industry best
practices for electrical characterization and measurement of electronic
packages. As part of the IEEE EPS EDMS Packaging Benchmark activity there are
on-going discussions for the best ways to characterize the SI, PI, and material
properties of an electronic package to drive advancements in simulation
technology.
Join us for this virtual tutorial on Sunday morning Oct. 17th at 9am Pacific
and bring your questions on tuning simulator parameters to match measurement
vs. the rigor of including tolerances with characterization measurements.
If you are interested in this tutorial be sure to register for the virtual
EPEPS 2021 Oct. 17th-20th conference on their website:
EPEPS-2021 Conference Final Program<http://www.epeps.org/program.htm>
Best Regards,
Heidi Barnes
Keysight Technologies
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