Dear SI-List Members,
The paper submission for 2020 IEEE Electrical Performance of Electronic
Packaging and Systems (EPEPS) Conference is open at
http://www.epeps.org/submission.html. EPEPS is the premier international
conference on advanced and emerging issues in electrical modeling,
measurement, analysis, synthesis, and design of electronic
interconnections, packages, and systems.
For this year's conference, we are very excited to announce the below
keynote presentations:
Jim Held (Intel, Director of Emerging Technologies Research): âMeeting the
Challenge of Building a Scalable Quantum Computerâ
Daniel M. Dreps (IBM, Distinguished Engineer/Designer): âHigh Speed & Large
Bandwidth Server Computer Bus Links: Past Milestones, Current State of The
Art and Future Directionsâ
We are looking forward to your submissions.
Kind Regards,
Kemal Aygun and Jose Hejase
IEEE EPEPS 2020 Co-Chairs
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