Hi, I have got reliable models of memories and processors provided in BGA packages. I use those models for signal-integrity simulations and I am quite confident of the positive results that I have got so far. Hoever, because of new European standard, most of digital components that I was using are now available into Pb-free (lead-free) BGA package, while the internal chips stay the same: any suggestions about possible changes into their IBIS models? From my point of view al least the R_pkg should be different... What about C_pkg and L_pkg? It looks that most of IC's vendors are providing the same IBIS models for both the leaded and lead-free versions. Any comments? Thanks, Giulio ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl?Si-List_FAQ List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu