[SI-LIST] HSPICE and Via Modeling

  • From: dav0 <david.lieby@xxxxxxxxxxx>
  • To: si-list@xxxxxxxxxxxxx
  • Date: Mon, 18 Jul 2005 11:27:40 -0700

I have an engineer who wants a detailed model of a via.
Mostly he is looking for capacitance.  The part of the
system he is working on runs at less than 5 MHz.  The
via is blind, with the closed end of the via ending
fairly close to a ground plane.



        __  __     Top Pad
________ ][ _____ Reference layer
          ][
---------][-----  routing layer 1
---------][-----  routing layer 2
________ ][ _____ Reference layer
          ][
---------][-----  routing layer 3
---------][-----  routing layer 4
________ ][ _____ Reference layer
          ][
---------][-----  routing layer 5
---------][-----  routing layer 6
        __][__     Bottom pad, end of via
_________________ Reference layer, at center of stackup

the same stackup reversed.

My questions:
1. Can one analyze this in HSPICE?
2. Does anyone have a spice deck with anywhere near
    a starting point, that they can share.

The vendor support engineer could not come up with
anything helpful.

Thanks,
dav0
David Lieby
Siemens Medical, USD, MVIS-S

------------------------------------------------------------------
To unsubscribe from si-list:
si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field

or to administer your membership from a web page, go to:
//www.freelists.org/webpage/si-list

For help:
si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field

List FAQ wiki page is located at:
                http://si-list.org/wiki/wiki.pl?Si-List_FAQ

List technical documents are available at:
                http://www.si-list.org

List archives are viewable at:     
                //www.freelists.org/archives/si-list
or at our remote archives:
                http://groups.yahoo.com/group/si-list/messages
Old (prior to June 6, 2001) list archives are viewable at:
                http://www.qsl.net/wb6tpu
  

Other related posts: