[SI-LIST] Re: HOW to use IBIS in HSPICE
- From: deltaboy <imsong@xxxxxxxxxxxx>
- To: <Nuria.Poblet@xxxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Fri, 29 Feb 2008 08:15:52 +0900 (GMT+09:00)
=C7=C1=B8=AE=C3=A7=B8=DE=C0=CF
=09 =09 This is one example which I trained 2 years ago.
1. Using IBIS Compo= nent
**********************************************************
* tes= t for iob: output buffer.transmission line.input buffer
****************= ******************************************
.option probe post
.ib= is comp component=3D'TEST' file=3D'1gs1062m.ibs' typ=3Dslow
+ PACKAGE=3D= 0
+ Interpol =3D 2
+ ramp_fwf=3D1
+ ramp_rwf=3D1
+ fwf_tune=3D1=
+ rwf_tune=3D1
Ven1 comp_vddq GND 3.3V
Vgnd1 comp_vssq GND 0V=
vin1 comp_dq0_i 0 3.3V pulse ( 0V 3.3V 0n 0.56n 0.56n 9.44n 20n )
Vd= q0_en comp_dq0_en GND 3.3V
*************************************= *********************
* TRANSMISSION LINE
***************************= *******************************
W1 comp_dq0 out2 0 comp_ba0 in2 0 FSmode= l=3D2line N=3D2 l=3D0.5
.MATERIAL diel_1 DIELECTRIC ER=3D4.5, LOSSTANGEN= T=3D0.035
.MATERIAL diel_2 DIELECTRIC ER=3D4.5, LOSSTANGENT=3D0.035
.= MATERIAL copper METAL CONDUCTIVITY=3D59.59meg
.SHAPE rect RECTANGLE WIDT= H=3D1mm HEIGHT=3D0.2mm
.LAYERSTACK stack_1 LAYER=3D(copper,1mm), LAYER= =3D(diel_1,2mm),
+ LAYER=3D(diel_2,3mm), LAYER=3D(copper,1mm)
.FSOPTI= ONS opt1 PRINTDATA=3DYES COMPUTEGD=3DYES COMPUTERS=3DYES
.MODEL 2line W = MODELTYPE=3DFieldSolver, LAYERSTACK=3Dstack_1,
+ FSOPTIONS=3Dopt1, RLGCF= ILE=3Dibis_comp_test.rlgc
+ CONDUCTOR=3D(SHAPE=3Drect ORIGIN=3D(0,3mm) M= ATERIAL=3Dcopper),
+ CONDUCTOR=3D(SHAPE=3Drect ORIGIN=3D(1.2mm,3mm) MATE= RIAL=3Dcopper)
*****************************************************= *****
* Analysis
****************************************************= ******
.tran 0.05n 100n
*.AC DEC 0 1K 5000MEG
********************= **************************************
*****************************= *****************************
* Output
******************************= ****************************
.print v(comp_dq0) v(comp_ba0)
.end
2. Using IBIS Buffer Model
**********************************= ************************
* test for iob: output buffer.transmission line= .input buffer
**********************************************************=
.option probe post
*********************************************= *************
* Stimuli(V_en must be exist)
*************************= *********************************
V_in nd_in 0 AC=3D3.3V DC=3D3.3V pulse= ( 0V 3.3V 0n 0.56n 0.56n 9.44n 20n )
V_en nd_en GND 3.3V
*******= ***************************************************
* OUTPUT BUFFER
*= *********************************************************
b2 nd_pu nd_pd= nd_out nd_in nd_en V_out_of_in nd_pc nd_gc
+ typ =3D slow
+ Interpo= l =3D 2
+ buffer =3D 3
+ xv_pu=3Dnd_state_pu
+ xv_pd=3Dnd_state_pd=
+ ramp_fwf=3D1
+ ramp_rwf=3D1
+ fwf_tune=3D1
+ rwf_tune=3D1+ file =3D '1gs1062m.ibs'
+ model =3D 'DQ_PIN'
*****************= *****************************************
* TRANSMISSION LINE
*******= ***************************************************
W1 nd_out in2 0 nd_i= n_1 out2 0 FSmodel=3Dcond2_sys N=3D2 l=3D0.5
.MATERIAL diel_1 DIELECTRIC= ER=3D4.5, LOSSTANGENT=3D0.035
.MATERIAL diel_2 DIELECTRIC ER=3D4.5, LOS= STANGENT=3D0.035
.MATERIAL copper METAL CONDUCTIVITY=3D59.59meg
.SHAP= E rect RECTANGLE WIDTH=3D1mm HEIGHT=3D0.2mm
.LAYERSTACK stack_1 LAYER=3D= (copper,1mm), LAYER=3D(diel_1,2mm),
+ LAYER=3D(diel_2,3mm), LAYER=3D(cop= per,1mm)
.FSOPTIONS opt1 PRINTDATA=3DYES COMPUTEGD=3DYES COMPUTERS=3DYES=
.MODEL cond2_sys W MODELTYPE=3DFieldSolver, LAYERSTACK=3Dstack_1,
+ = FSOPTIONS=3Dopt1, RLGCFILE=3Dex3.rlgc
+ CONDUCTOR=3D(SHAPE=3Drect ORIGIN= =3D(0,3mm) MATERIAL=3Dcopper),
+ CONDUCTOR=3D(SHAPE=3Drect ORIGIN=3D(1.2= mm,3mm) MATERIAL=3Dcopper)
*****************************************= *****************
* INPUT BUFFER
************************************= **********************
b1 nd_pc_1 nd_gc_1 nd_in_1 nd_out_of_in_1
+ ty= p=3Dslow
+ Interpol =3D 2
+ file =3D '1gs1062m.ibs'
+ model =3D 'A= DDR_PIN'
*********************************************************** Analysis
**********************************************************=
.AC lin 1000 0Hz 50GHz
.tran 0.05n 100n
*************************= *********************************
**********************************= ************************
* Output
***********************************= ***********************
.print tran v(nd_pu) v(nd_pd) v(nd_out) v(nd_in)=
+ v(nd_in_1) v(nd_out_of_in_1) v(nd_state_pu) v(nd_state_pd)
.en= d
Good luck.
---------- =BF=F8=BA=BB = =C6=ED=C1=F6 ----------
=BA=B8=B3=BD=BB=E7=B6=F7: Poblet, Nuria=BA=B8=B3=BD=B3=AF=C2=A5: 2008/2/28
15:44:6
=B9=DE=C0=BA=BB= =E7=B6=F7: si-list@xxxxxxxxxxxxx
=C1=A6=B8=F1: [SI-LIST] HOW = to use IBIS in HSPICE
Hello,Hello,I am working in hspice= trying to use IBIS file, but the
documentation about this is very confused= and difficult. I use Hspice in
others items.Could you help me? Any informa= tion is useful.Thank you N?ia
Poblet***************************************=
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In-myoung Song
*******************************************
*** SI Engineer / Internex Ltd. South Korea ***
*** E-Mail : imsong@xxxxxxxxxxxx &nbs= p; ***
*** Cellular Phone : +82-11-9034-8480  = ; ***
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--- Links ---
1 3D
2 3D"http=
3 3D
4 3D"http=
5 3D
6 3D"http=
7 3D
8 3D"http=
9 3D
10 3D"http=
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