[SI-LIST] Re: Effect of vias on Ground performance
- From: "winson yu" <winsonyu@xxxxxxxxxxx>
- To: <lweemei@xxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Thu, 24 Jan 2002 17:05:33 -0800
Hi Wee Mei,
You can find Dr. Jin Zhao's paper " Effects of power/ground via distribution
on the power/ground performance of C4/BGA packages" at
http://www.sigrity.com/support_tech_doc.htm
You may also check out the following papers;
1. Titled "Shorting Via Arrays for the Elimination of Package Resonance to
Reduce Power Supply Noise in Multi-layered Area-Array IC Packages" presented
at 1998 IEEE Symposium on IC/Package Design Integration.
2. Titled "Significance of Electromagnetic Coupling Through Vias in
Electronics Packaging" in the Proceeding of 1997 IEEE 6th Topical Meeting on
EPEP conference.
3. Tilted " Via and Return Path Discontinuity Impact on High Speed Digital
Signal Quality" -- by Qinglun Chen, Intel, EPEP Conf., October 2000
The link to the paper 1 and 2 at http://www.sigrity.com/support_tech_doc.htm
and the paper #3 at http://www.sigrity.com/support_cus_doc.htm
Best Regards
Winson Yu
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx
[mailto:si-list-bounce@xxxxxxxxxxxxx]On Behalf Of Zhou, Xingling (Mick)
Sent: Thursday, January 24, 2002 4:21 PM
To: 'lweemei@xxxxxxxxxx'; si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: Effect of vias on Ground performance
I know a paper by Jin Zhao etc. in the Proceedings of the 7th topical
meeting on electrical performance of electronic packaging, Oct., 1998. The
title is " Effects of power/ground via distribution on the power/ground
performance of C4/BGA packages". It provides some information.
Regards.
Mick
-----Original Message-----
From: fullname [mailto:lweemei@xxxxxxxxxx]
Sent: Thursday, January 24, 2002 6:47 PM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Effect of vias on Ground performance
I was asked to check what is the effect of vias on ground performance.
Any kind souls out there can provide me with some information or
references for me?
Thanks and regards - Wee Mei
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