Dear Members,
The call for papers for the 24th Conference on Electrical Performance of
Electronic Packaging and Systems submission deadline has been extended to
July 24, 2015. The submission procedure can be found at http://epeps.org
and can be accessed through the link Call for Papers. The conference will
be held during Oct. 25-28, 2015, in San Jose, California.
Also there are great opportunities provided for companies to showcase
their products/brands through structured sponsorships/exhibitions, details
of which can be found in the link Sponsorship Packages. We look forward to
your participation in this premier conference on signal integrity,
interconnects and electronic packaging.
For more information, please contact EPEPS administrator, Emma Marshall
via email, epeps-admin@xxxxxxxxxxxx.
Sincerely,
EPEPS Co-Chairs: Jose Schutt-Aine, University of Illinois and Dale
Becker, IBM
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