Hi,
I am not a fabricator but a hw designer.
The typical plating thickness varies fab to fab, so you should decide which
companies to work with, then get their data. You should contact each of them
one by one in person.
In the past I inquired about this with some (I don't remember) company, and
they told me:
For fine line lithography (4mil traces typical for high density digital
boards) they need to use 17um copper on outer layers, and the total
thickness after plating will be 25um (another company 30um). Convert it to
mils if you like.
Regards,
Istvan Nagy
Fortinet
-----Original Message-----
From: Doug Brooks
Sent: Sunday, November 22, 2015 3:34 PM
To: SI
Subject: [SI-LIST] Copper plating
This is a question primarily for PCB board fabricators, or anyone who
has specifically made accurate measurements:
What is the typical thickness tolerance on plated copper. That is, if I
specify a plated thickness of 1.0 Oz (nominally 1.3 mils), what is the
range (board top to board bottom, board front to board back, etc.) of
actual thickness I can expect.
I am guessing it is about 50%. I will not associate your company name
with your answer!! I am not trying to get sales pitches or anything ---
just honest assessments.
Thanks
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