[SI-LIST] Re: Choice of routing layers

  • From: steve weir <weirsp@xxxxxxxxxx>
  • To: maheshkrish@xxxxxxxxxxx, si-list@xxxxxxxxxxxxx
  • Date: Thu, 29 Apr 2004 16:24:14 -0700

Mahesh, the correct answer lies in what the IC vendor used as the reference 
in the package.  The key thing to remember is that the power / ground entry 
to the package each compose a formidable impedance in the path of any high 
speed signal.  The way that signals get out of a package is through a 
transmission line where the input port is the signal and one of the voltage 
rails.  You want the PCB to simply be a continuation of that transmission line.

  Taking advantage of Jon's neat sidraw tool:


  * The following text constitutes a picture drawn using the SI Draw 
(v1.11) tool.
   * Simply copy this text to a file, save the file with a .OUT extension, and
   * open the file with the SI Draw tool. Or you can use the standard UNIX 
(esc w)(cntrl-k) or WINDOWS CUT and PASTE
   * commands to paste in sidraw. All spurious text should be ignored so 
you can use SELECT ALL from
   * The edit menu pulldown in your email if applicable. You can download 
the SI Draw tool
   * from http://www.si-list.org/files/tools/.

     *

LINE: blue 105.0 90.0 120.0 90.0 120.0 85.0 125.0 80.0 130.0 80.0 135.0 
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195.0 300.0
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TEXT: black 140.0 145.0 w TX LINE
TEXT: black 140.0 230.0 w TX LINE
TEXT: black 80.0 395.0 w PWB reference should match package reference
POLY: black none 290.0 125.0 290.0 275.0 465.0 275.0 465.0 120.0 290.0 
120.0 290.0 125.0
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LINE: black 375.0 275.0 375.0 300.0
TEXT: black 330.0 180.0 w Diff TX LINE
TEXT: black 85.0 40.0 w Package
TEXT: black 375.0 55.0 w PCB
END:

Steve.
At 11:34 PM 4/29/2004 +0100, Mahesh Krishnan wrote:
>Hello Everyone,
>I had question related to the choice of routing layer for the differential 
>10Gbps Ethernet signals. The 10G interface signals are referenced to 1.2V. 
>Which of the following routing options would be better from the point of 
>view of reducing emissions?
>
>Option1: Routing on signaling layers sandwiched by ground on either side 
>(stripline formed by 2 ground planes)
>
>Option2: Routing on signalling layers sandwiched by a ground and 1.2V on 
>either side (stripline formed by a ground and 1.2V plane)
>
>Please let me know your thoughts.
>
>Thanks,
>--mahe.
>
>
>
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