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ASIAN IBIS SUMMIT (TOKYO) 2019
AGENDA AND REGISTRATION
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Time/Date: Friday, November 8, 2019, 12:30 PM to 5:00 PM
Meeting starts at 1:00 PM
Location: Akihabara UDX Bldg.
4-14-1, Sotokanda, Chiyoda-Ku
Tokyo 101-0021, Japan
http://www.akiba-cross.jp/english/
Room: NEXT-1
Content: Presentations and Discussions
Purpose: Solicit and exchange IBIS and interconnect model related
information and ideas.
Organizational Sponsors:
Japan Electronics and Information Technology Industries Association
(JEITA)
IBIS Open Forum
Co-sponsors (in alphabetical order):
ANSYS, Inc.
Apollo Giken Co., Ltd.
Keysight Technologies
Ricoh
Toshiba Corporation
Zuken, Inc.
Cost: FREE
JEITA IBIS Class and Summit:
http://ec.jeita.or.jp/jp/modules/eguide/event.php?eid=41
BACKGROUND
This year we are holding the 14th Asian IBIS Summit meeting in Japan. Several
high-technology Japanese companies operate in the Tokyo and Yokohama area and
are affiliated with JEITA and IBIS.
IBIS SUMMIT
This meeting will be conducted as a formal IBIS Summit Meeting. Presentations
will be archived in an electronic format on our Summits site, and minutes of
the meeting will be issued. However, no formal decisions requiring votes will
be planned.
http://www.ibis.org/summits/
CALL FOR PARTICIPANTS
People involved in IBIS and interconnect model development, EDA tool
development, and digital circuit design are invited to participate in the
Summit meeting.
If you plan to participate, please register using the information below (in
English):
Name:
E-mail address:
Company:
Country:
Send to BOTH:
Satoshi Nakamizo, Keysight Technologies Japan K.K. edamodel@xxxxxxxxxxxx
Bob Ross, Teraspeed Labs bob@xxxxxxxxxxxxxxxxx
SIGNUP DEADLINE: November 1, 2019
AGENDA (Tentative)
13:00 SIGN IN
13:05 MEETING WELCOMES
Randy WOLFF (Micron Technology, USA)
Satoshi NAKAMIZO (Keysight Technologies Japan K K)
13:15 IBIS Chair's Report
Randy WOLFF (Micron Technology, USA)
13:30 Expectations for the New Package Model Specification of
IBIS 7.0
Masaki KIRINAKA, Akiko TSUKADA
(Fujitsu Interconnect Technologies Limited, Japan)
[Presented by Masaki KIRINAKA, Akiko TSUKADA
(Fujitsu Interconnect Technologies Limited, Japan)]
14:00 The On Die Decap Modeling Proposal (BIRD198)
Megumi ONO (Socionext Inc., Japan)
14:35 IBIS File Format Links
Bob ROSS (Teraspeed Labs, USA)
[Presented by Randy WOLFF (Micron Technology, USA)]
15:00 BREAK
15:20 How to Obtain Buffer Impedance from IBIS
Lance WANG (Zuken, USA)
15:50 A Potential Application of IBIS Models to CISPR25 Based
EMI Analysis of DCDC Converter
Kazuyuki SAKATA*, Koji ICHIKAWA**, Miyoko GOTO***,
Toshiki KANAMOTO****
(Renesas Electronics Corporation*, DENSO Corp.**,
Ricoh Corp***, Hirosaki University****; Japan)
[Presented by Kazuyuki SAKATA
(Renesas Electronics Corporation, Japan)]
16:10 IBIS-AMI & COM Co-design for 25G Serdes
Nan HOU*, Amy ZHANG*, Guohua WANG*, David ZHANG**,
Anders EKHOLM** (Ericsson, *PRC, **Sweden)
[Presented by Anders EKHOLM (Ericsson, Sweden)]
16:50 CONCLUDING ITEMS
17:00 END OF IBIS SUMMIT MEETING
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