[SI-LIST] Agenda, IBIS Summit at DesignCon, Jan. 31, 2014

From: "Mirmak, Michael" <michael.mirmak@xxxxxxxxx>
To: "si-list@xxxxxxxxxxxxx" <si-list@xxxxxxxxxxxxx>
Date: Sat, 25 Jan 2014 04:22:53 +0000
Please join us for the free IBIS Summit at DesignCon in Santa Clara next week!


Presentation materials will be available on-line after the event.



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                      AGENDA - IBIS SUMMIT MEETING

                       Friday, January 31, 2014



                     Santa Clara Convention Center

                        Santa Clara, California



                         Room: Mission City M1

                      First Floor (look for signs)



Sponsored by Agilent Technologies, DesignCon and the IBIS Open Forum



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                  (order and times subject to change)



8:00 AM     Refreshments & Sign In



8:30 AM     Official Opening

            - Welcome to Summit

            - Introductions



8:45 AM     Chair's Status Report

            Michael Mirmak, Intel Corporation



9:15 AM     Rantings of an IBIS Minimalist

            Ken Willis, Cadence Design Systems



9:35 AM     IBIS and SAE

            Chris Denham, SAE International



9:55 AM     BREAK



10:10 AM    IBIS-ATM Task Group Report

            Arpad Muranyi, Mentor Graphics Corporation



10:30 AM    Package Modeling Proposal with [External Circuit]

            Arpad Muranyi, Mentor Graphics Corporation

            Ambrish Varma, Cadence Design Systems



11:00 AM    IBIS Package Proposal

            Walter Katz, Signal Integrity Software (SiSoft)



12:00 PM    LUNCH

            Pre-registration required



1:00 PM     IBIS-AMI Validation

            Zilwan Mahmod and Anders Ekholm, Ericsson



1:40 PM     An Advanced Behavioral Buffer Model with Over-Clocking Solution

            Yingxin Sun, Joy Li, and Joshua Luo, Cadence Design Systems



2:25 PM     Build Your Own IBISCHK

            Bob Ross, Teraspeed Consulting Group

            Mike LaBonte, Signal Integrity Software (SiSoft)



2:45 PM     BREAK



3:00 PM     Memory Packaging Technology & Modeling

            Randy Wolff, Micron Technology



3:30 PM     Open Discussion



4:45 PM     Concluding Items

            - Next Open Forum Meeting: February 21, 2013



5:00 PM     End of Meeting Room Availability



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If you plan to participate, please register with the information below:



   Name:

   E-mail address:

   Company:

   Telephone:



Send to: Lance Wang (lwang@xxxxxxxxxx)



Sponsors:   Agilent Technologies, DesignCon, IBIS Open Forum



DesignCon:  January 28 - 31, 2014

            Santa Clara Convention Center

            Santa Clara, California

            See http://www.designcon.com/ for more information.




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[SI-LIST] Agenda, IBIS Summit at DesignCon, Jan. 31, 2014

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