Hi All, Can u just help me out in layer stack up. I will just describe abt our critical signals. Iam designing a board of 12 Layer which got both High-speed Digital and RF signals of up to CPRI rate-4 i.e., 3.125Gbps. We have several power supplies to cater the needs of the FPGA and other digital and RF components. And high-speed clocks are also available @ 1GHz rate. And we are having high-speed DACs & ADCs with LVDS interface. And the DACs and ADCs are interfaced with Vertex-5 FPGAs. And we have signals of High-sped SERDES interface for CPRI interface too. Iam very concerned about my Board size its very compact with having all the high-speed signals. So what are main concerns with high-speed LVDS signals? And can u just suggest best stack up which i can proceed with? Thanks in advance. Regards Sree ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu