We're in the early architectural stages for developing a custom ASIC for PCI-X (133MHz). Our ASIC vendor has requested from us the package requirements for this ASIC. Our initial thoughts is that the package must be 1mm BGA, flip chip (no wire bonds!), power planes, and ground planes. My question is how would we describe the signal traces? Do we say we desire controlled impedance or very small RLC values for the signals so they're electrical short? Any comments on what an ideal package for PCI-X should be would be very appreciative. Thanks, Norm Smith NCR Corp San Diego, CA 92127 858.485.2868 ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu