Mehrdad, Any copper fill on Top and Bottom layer will have too little inter-plane capacitance (due to large separation from Power/Ground planes) to be of significance. Regards, Ravinder Server PCB and Flex Development Hitachi Global Storage Technologies Email: Ravinder.Ajmani@xxxxxxxx "Mehrdad Salami" <msalami@xxxxxxxxxx> Sent by: si-list-bounce@xxxxxxxxxxxxx 07/03/2003 05:39 PM Please respond to msalami To: "'[SI-LIST]'" <si-list@xxxxxxxxxxxxx> cc: From: si-list-bounce@xxxxxxxxxxxxx Subject: [SI-LIST] Re: 8 Layer stack up Hi Ravinder, Is there any reason not putting fill for the top and bottom layers. In this example the top layer with Power and bottom layer with Ground. Mehrdad Salami Hardware Design Engineer Colour Vision Systems -----Original Message----- From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On Behalf Of Ravinder.Ajmani@xxxxxxxx Sent: Friday, July 04, 2003 1:38 AM To: nagaraj@xxxxxxxxxxxxxxxxxxxx Cc: [SI-LIST] Subject: [SI-LIST] Re: 8 Layer stack up Nagaraj, The stackup provided in your note will provide good power plane decoupling, but will cause wiring nightmare because of coupling between three signal planes on each side of the Power/Ground planes. Also, traces on Top and Bottom layers will be too far removed from the shield planes, resulting in excessive crosstalk and EMI. If you can have only two Power/Ground planes then you may try the following stackup: Top Signal <- Fill with Ground Power Signal <- Fill with Ground Signal <- Fill with Power Ground Signal <- Fill with Power Bottom The middle two signal layers should be used for routing high-speed signals for EMI reduction. In order to decouple the power supplies, you should fill empty space on planes adjacent to Power and Ground planes with Ground and Power shapes respectively. However, make sure that it does not impact impedance of signals on adjacent layers. Also, avoid overlapping power supply shapes of different voltages. This is my $0.01. Regards, Ravinder Server PCB and Flex Development Hitachi Global Storage Technologies Email: Ravinder.Ajmani@xxxxxxxx "Nagaraj" <nagaraj@xxxxxxxxxxxxxxxxxxxx> Sent by: si-list-bounce@xxxxxxxxxxxxx 07/03/2003 12:19 AM Please respond to nagaraj To: "[SI-LIST]" <si-list@xxxxxxxxxxxxx> cc: Subject: [SI-LIST] 8 Layer stack up Hi Gurus, What will be the Best Layer Stack up for 8 Layer Board, Constraint is we can have only 2 Planes, Top Signal Signal Power GND Signal Signal Bottom Board Construction with Through Hole Vias Please Comment on this. 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