I'm doing layout on a board(blind/buried) that was previously Class 2 and is changing to Class 3. After reviewing Appendix A on pg 25 of IPC-6012A, I've only been able to identify the annular ring on vias as an issue that would affect me during the design process. It seems that most of the other charcteristics would have to upheld during fabrication or assembly of the boards. Can anyone tell me of any other areas that I would have to watch for during layout in order to adhere to Class 3 specs? Mike Golding \ mike.golding@xxxxxxxxxx PCB Designer \ +1-920-969-6114 Phone Plexus Technology Group \ +1-920-428-3280 Cell 55 Jewelers Park Drive \ +1-920-751-5659 Fax Neenah, WI 54957 \ www.plexus.com <http://www.plexus.com>