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IBIS Summit at DesignCon 2022
Second Call for Participation and Presentations
The IBIS Open Forum is pleased to announce our hybrid virtual/in-person IBIS
Summit meeting following the DesignCon 2022 event on Friday, April 8, 2022.
NOTE: The IBIS summit takes place after the last day of DesignCon. Please
consider this in your travel plans.
This hybrid virtual/in-person IBIS Summit is designed to enable face-to-face
interactions between model users, model makers and EDA tool developers in the
IBIS community as well as including those unable to travel to DesignCon this
year. Those interested in presenting at or in attending the event may register
using the information below. We also encourage the IBIS community to register
for
DesignCon<https://designcon.im.informa.com/2022/?reportSuite=informadesigncon&utm_source=Partner&utm_medium=Comarketing&utm_campaign=NAM22DSC-EH-IBISBanner&utm_content=&utm_term=&utmMDMContactID=&PromoCode=ibis&formId=null&formName=DesignCon%C2%AE%202022%20Attendee%20Registration&formType=Visitor%20Registration>
using the 20% discount promo code "IBIS" (see below).
IBIS summit meetings are made possible by generous sponsors (see below). We
welcome additional sponsors to cover some of the meeting expenses, including
the FREE lunch and refreshments.
We look forward to seeing you in Santa Clara or online!
Randy Wolff
Chair, IBIS Open Forum
________________________________
Hybrid Virtual/In-person IBIS Summit at DesignCon 2022
Second Call for Participation and Presentations
________________________________
TIME/DATE:
Friday, April 8, 2022
8:00am - TBD PDT (UTC-7)
11:00am - TBD EDT (UTC-4)
5:00pm - TBD CEST (UTC+2)
ROOM:
TBD
LOCATION:
Santa Clara Convention Center
5101 Great America Parkway
Santa Clara, California 95054
Online, details TBD
CONTENT:
Presentations and Discussions
COST:
FREE
SPONSORS:
IBIS Open Forum
Informa Markets
Others to be determined
We are seeking more co-sponsors. The benefits to sponsors include recognition
at the meeting and acknowledgment in the calls for participation and
presentations. Your financial support strengthens the organization by allowing
IBIS to focus resources on industry activities rather than raising money. You
will receive generous thanks and public acknowledgment for your support.
Please contact Randy Wolff (chair@xxxxxxxx<mailto:chair@xxxxxxxx>) for
co-sponsorship information.
________________________________
[A picture containing text Description automatically
generated]<https://www.designcon.com/en/home.html?utm_source=Partner&utm_medium=Comarketing&utm_campaign=NAM22DSC-EH-IBISBanner>
Use promo code IBIS for 20% discount on DesignCon
registration<https://designcon.im.informa.com/2022/?reportSuite=informadesigncon&utm_source=Partner&utm_medium=Comarketing&utm_campaign=NAM22DSC-EH-IBISBanner&utm_content=&utm_term=&utmMDMContactID=&PromoCode=ibis&formId=null&formName=DesignCon%C2%AE%202022%20Attendee%20Registration&formType=Visitor%20Registration>!
________________________________
BACKGROUND
DesignCon is the premier annual Silicon Valley event for the electronic design
automation (EDA) and semiconductor industry. Topics of current interest to the
IBIS Open Forum are addressed at DesignCon.
This meeting will be conducted as a formal IBIS meeting. Presentations are
expected to be available in an electronic format, and minutes of the meeting
will be issued.
CALL FOR PARTICIPANTS
People involved in IBIS or related signal integrity and/or power integrity
model development or EDA tool development are invited to participate. If you
plan to participate, please register with the information below:
Name:
Company:
Send to:
Lance Wang (lance.wang@xxxxxxxx<mailto:lance.wang@xxxxxxxx>)
Deadline:
Friday, April 1, 2022 for on-site participation to reserve free lunch
Wednesday, April 6, 2022 for virtual participation. Meeting link information
will only be sent to registered participants
CALL FOR PRESENTATIONS
We are seeking presentations from individuals who have experiences of interest
to the IBIS modeling community. These can include, but are not limited to:
* Demonstrations of modeling techniques
* Explanations of behavioral algorithms
* Descriptions of difficulties encountered
* Model correlation
* Modeling building experiences
* Comparisons to other modeling methods
* New technologies for modeling buffers and components
* New technologies for modeling packaging and interconnects
* Algorithmic modeling topics
* Ideas for IBIS model users
* Signal and/or Power Integrity modeling
Presentations may be addressed to any and all levels of IBIS experience, from
beginner to expert.
Electronic Archival:
* We require electronic versions so they can be shared during the virtual
meeting, archived on the IBIS website<https://ibis.org/>, and made available to
non-attendees.
* We prefer Microsoft PowerPoint* or Adobe PDF*.
* Please send presentations for processing and brief review.
If you plan a presentation, please supply the following information as soon as
possible:
Title:
Presenter:
Company:
Estimated Time Required:
Usually 15 to 45 minutes (allow time for questions)
Send to:
Bob Ross (bob@xxxxxxxxxxxxxxxxx<mailto:bob@xxxxxxxxxxxxxxxxx>)
Deadline:
Friday, March 25, 2022
All submissions will be reviewed by the IBIS Board and are subject to approval
before presentation at the Summit.
Note: vendor-specific, confidential, or product promotion material is forbidden
at IBIS summits. Presentations must be submitted by the deadline for review.
The IBIS Open Forum reserves the right to reject submitted presentations or
stop a scheduled presentation containing content that has not been reviewed.
AGENDA
The agenda includes presentations, discussions, breaks, and lunch. A formal
list of speakers and topics will be released one week prior to the event.
HOTEL AND TRAVEL INFORMATION
See the DesignCon Travel and Venue
page<https://www.designcon.com/en/plan-travel/useful-information.html> for
hotel information and transportation suggestions.