[ibis-macro] Re: Topics for 8/21/12 IBIS-ATM meeting
- From: "Walter Katz" <wkatz@xxxxxxxxxx>
- To: <Arpad_Muranyi@xxxxxxxxxx>, "'IBIS-ATM'" <ibis-macro@xxxxxxxxxxxxx>
- Date: Thu, 16 Aug 2012 22:09:35 -0400 (EDT)
Arpad,
From http://en.wikipedia.org/wiki/Multi-chip_module
A multi-chip module (MCM) is a specialized electronic package where
multiple <http://en.wikipedia.org/wiki/Integrated_circuit> integrated
circuits (ICs), semiconductor dies or other discrete components are
packaged onto a unifying substrate, facilitating their use as a single
component (as though a larger IC). The MCM itself will often be referred
to as a "chip" in designs, thus illustrating its integrated nature.
In IBIS 5.0:
- it was designed to describe the printed circuit BOARDs
of memory modules in the days when memory modules used to
be modeled as a lumped capacitance and we felt that more
details were necessary to find the timing to the memory
chips on these memory modules
In BIRD 36.3
Buffer Issue Resolution Document (BIRD)
BIRD ID#: 36.3
ISSUE TITLE: Electric Descriptions of Boards
REQUESTER: Stephen Peters, Intel, Hank Herrmann, AMP
DATE SUBMITTED: June 23, 1996, Feb. 13, 1997, March 7, 1997, March 31,
1997
DATE ACCEPTED BY IBIS OPEN FORUM: April 8, 1997
**************************************************************************
****
**************************************************************************
****
STATEMENT OF THE ISSUE: There is a need to describe SIMM modules and
related
type components that consist of one or more ICs mounted on a PCB board
that
connects them to a system thru a set of pins. The following BIRD proposes
a
new type of file called .ebd (Electrical Board Description) that
addresses this need. This proposal does not encompass an electrical
description of connectors and other interconnect devices.
So the statement of the issue for BIRD 36.3, the EBD BIRD, states quite
clearly that EBD satisfies the
"need to describe SIMM modules". According to Wikipedia a SIMM (similar to
a DIMM) is
"a specialized electronic package where multiple integrated circuits
<http://en.wikipedia.org/wiki/Integrated_circuit> (ICs), semiconductor
dies or other discrete
components are packaged onto a unifying substrate". That substrate could
be a "board" using FR4, or ceramic.
So from the very beginning EBD was targeted to packages (using either
board or ceramic substrates), and in practice,
every EBD file I have seen has been for packages that are mounted either
vertically (SIMM, DIMM) or horizontally (mezzanine style).
I think the above statements clearly resolve the issue. You may think that
it "is not the right thing to do",
But the BIRD Statement of the Issue, IBIS 5.0, Wikipedia, and common
practice say otherwise.
Walter
From: ibis-macro-bounce@xxxxxxxxxxxxx
[mailto:ibis-macro-bounce@xxxxxxxxxxxxx] On Behalf Of Muranyi, Arpad
Sent: Thursday, August 16, 2012 8:39 PM
To: IBIS-ATM
Subject: [ibis-macro] Re: Topics for 8/21/12 IBIS-ATM meeting
Walter,
I am sorry, but I did not get the impression that anything has been
resolved in the email thread we had on EBD. At this time I still
maintain my position that using EBD for package modeling is not the
right thing to do. I know you see things differently, but I don't
think that this difference between our views were resolved by any
means.
Arpad
=====================================================================
From: ibis-macro-bounce@xxxxxxxxxxxxx
[mailto:ibis-macro-bounce@xxxxxxxxxxxxx] On Behalf Of Walter Katz
Sent: Thursday, August 16, 2012 6:52 PM
To: IBIS-ATM
Subject: [ibis-macro] Topics for 8/21/12 IBIS-ATM meeting
All,
It has been resolved via e-mail thread that EBD files describe modules
containing two or more IC's. These modules can be boards, or packages.
Arpad and I plan to evaluate this syntax and the BIRD 125 and 145 syntax
and report to the committee with our recommendations.
The enclosed presentation summarizes all of the proposed parameter tree
syntax by using simple examples that demonstrate the proposed package
modeling functionality for IBIS 6.0.
I previously sent out an example applying this functionality to an EBD
example.
Walter
Walter Katz
wkatz@xxxxxxxxxx
Phone 303.449-2308
Mobile 303.335-6156
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