Hi all, With regard to the action item I took at last week's ICM meeting: Find out if Altera's on-die interconnect Touchstone files include any of the driver's a.c. behavior. The answer is: No, they do not. They are a "pure" description of the actual passive physical structure lying between the drains of the final drive totem pole and the point of die attach. They are generated using 3D extraction tools, as opposed to measurements. In my discussion with my ICD folks, someone made a very interesting point: The manufacturing variation of the on-die interconnect response characteristics is typically the result of physical dimension variance, which in turn is caused by the inherent tolerances of the photo-lithography process. Conversely, the variation in the driver output stage characteristics are most often primarily due to voltage, temperature, and process variation. So, if we were to include the driver output stage a.c. behavior in the Touchstone file representing the on-die interconnect, we would be hard pressed to adequately describe typ., min. and max. behaviors for the combined entity, and the range of validity of a Touchstone file so constructed might be very limited. (This sounds a lot like what Brad was saying, last week.) Also, in order to ensure that I was making myself understood, I asked them, "Which of the following is the correct source to drive our on-die interconnect Touchstone files: an ideal step, or a model of the driver?" They answered, unequivocally, "A model of the driver." Looking forward to hearing everyone's thoughts on this, although I won't be able to attend this week. Regards, David Banas Sr. Member Technical Staff Altera<http://www.altera.com/> +1-408-544-7667 - desk Did you know Altera offers over 150 free online technical training courses<http://www.altera.com/servlets/searchcourse?coursetype=Online&WT.mc_id=t9_ot_mi_mi_tx_a_311>? Take one today! ________________________________ Confidentiality Notice. This message may contain information that is confidential or otherwise protected from disclosure. If you are not the intended recipient, you are hereby notified that any use, disclosure, dissemination, distribution, or copying of this message, or any attachments, is strictly prohibited. If you have received this message in error, please advise the sender by reply e-mail, and delete the message and any attachments. Thank you.