[ibis-macro] Minutes from the 14 Jan 2014 ibis-atm meeting
- From: Mike LaBonte <mike@xxxxxxxxxxx>
- To: ibis-macro@xxxxxxxxxxxxx
- Date: Tue, 21 Jan 2014 14:37:03 -0500
Minutes from the 14 Jan 2014 ibis-atm meeting are attached.
Mike
IBIS Macromodel Task Group
Meeting date: 14 January 2013
Members (asterisk for those attending):
Agilent: Fangyi Rao
* Radek Biernacki
Altera: David Banas
Julia Liu
Hazlina Ramly
ANSYS: Samuel Mertens
* Dan Dvorscak
* Curtis Clark
Steve Pytel
Luis Armenta
Arrow Electronics: Ian Dodd
Cadence Design Systems: Terry Jernberg
* Ambrish Varma
Feras Al-Hawari
* Brad Brim
Kumar Keshavan
Ken Willis
Cavium Networks: Johann Nittmann
Celsionix: Kellee Crisafulli
Cisco Systems: Ashwin Vasudevan
Syed Huq
Ericsson: Anders Ekholm
IBM: Greg Edlund
Intel: Michael Mirmak
Maxim Integrated Products: Mahbubul Bari
Hassan Rafat
Ron Olisar
Mentor Graphics: * John Angulo
Zhen Mu
* Arpad Muranyi
Vladimir Dmitriev-Zdorov
Micron Technology: * Randy Wolff
Justin Butterfield
NetLogic Microsystems: Ryan Couts
Nokia-Siemens Networks: Eckhard Lenski
QLogic Corp. James Zhou
Andy Joy
SiSoft: * Walter Katz
Todd Westerhoff
Doug Burns
* Mike LaBonte
Snowbush IP: Marcus Van Ierssel
ST Micro: Syed Sadeghi
Teraspeed Consulting Group: Scott McMorrow
* Bob Ross
TI: Casey Morrison
Alfred Chong
Vitesse Semiconductor: Eric Sweetman
Xilinx: Mustansir Fanaswalla
Ray Anderson
The meeting was led by Arpad Muranyi
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Opens:
- None
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Call for patent disclosure:
- None
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Review of ARs:
- Walter send presentation to Mike for posting
- Done
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New Discussion:
Package Model proposal from Walter Katz:
- Arpad: Is there any more to discuss?
- Walter: I will have a presentation at the upcoming summit.
- Bob: The title has "IBIS-ISS" but it covers both that and Touchstone.
- Both "buf" and "mod" are used, and it is not always clear if they are the
same.
- Walter: Pin, pad, and buf are separate items.
- Where "model" is used it is a model definition name.
- "IO" is a model type.
- Bob had objected to "+" and "-", preferring "p" and "n".
- Bob: On slide 17 "V" should be separated from "IO" with underscore.
BIRDS 163, 164, 165
- Arpad: BIRDs 163 and 164 could be merged, are co-dependent.
- BIRD 165 is independent of the others.
- Arpad showed BIRD 164.
- Arpad: This makes [External Circuit] usable for package models.
- There was a suggestion that "Package_Model" could have a value.
- Bob: It could be [External Package Model].
- Arpad showed BIRD 163.
- Arpad: Black text is unchanged, red text is changed.
- This adds the ability to connect to [Model] terminals directly.
- We found a way to cascade model with external circuits.
- Each model is instantiated by [Pin], but the circuit models are aligned to
connect.
- Bob: [Model] includes [External Model]?
- Arpad: Yes.
- The first example drawing has changed significantly.
- One circuit describes on-die interconnect, another the package.
- The numbers after the colons indicate the associated pin numbers.
- Radek: Walter's proposal has a buffer concept that is similar.
- Walter: Agree, this is the same functionality with a different syntax.
- Why can't a die node be anything other than die pad?.
- Are die nodes die pads?
- Arpad: Yes.
- There are buffer nodes that exist only for internal connections.
- [Node Declarations] would only be needed for internal die nodes.
- The main change for [Circuit Call] is new reserved node names for buffer
ports.
- Arpad noted that the BIRD has a "questions" section.
- Arpad: The previous example Figure 29 showed features not supported by IBIS.
- This is corrected in this BIRD.
- Power and ground connection would work in concert with new supply bus
keywords.
- John: This shows everything it can do in one figure.
- Ambrish: BIRDs 145 and 125 would be rejected?
- Arpad: Yes, once this is approved.
- Bob: [External Model] could be called too?
- Arpad: No they are called only from [Model].
- [Circuit Call] is only needed once to instantiate the circuit.
- Walter: What do power ports connect to where the power comes from multiple
pins?
- Arpad: The spec is vague on that.
- If [Pin Mapping] is used it is more clear.
- There has to be one buffer per signal pin.
- There could be joins and splits but it has to end at one buffer instance.
- John: We have examples of this, although no picture.
- Walter: Where does the model in D come from?
- Arpad: I haven't worked out how [External Model] would work with this.
- John: IC vendors have not often used circuit calls to instantiate buffers.
- Mike: Pin names might allow colons, the instantiation syntax might be
confusing.
- Walter: Aren't the "pos" and "Neg" reserved ports redundant?
- Arpad: Those are for series switch models, they are different ports.
- Walter: In the figure pads 3a and 3b go to one pin?
- Arpad: Yes.
- Walter: Where does the output of the driver in C go to?
- Arpad: This meets the rule that one pin goes to one model instance.
- It was in the previous spec, I didn't delete it.
- Walter: We should have examples of this matching some of my examples.
- For example, SDRAM, FPGA, and ASIC examples with realistic package models.
- We should compare our proposals for functionality.
- Bob: Does this deprecate legacy buffers?
- Arpad: Nothing is deprecated.
- Walter: The package model could be other than IBIS-ISS?
- Arpad: Yes.
- Bob: I would like to see a legacy buffer added to the figure.
- Arpad: That might be confusing.
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Next meeting: 21 January 2013 12:00pm PT
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IBIS Interconnect SPICE Wish List:
1) Simulator directives
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