All,
Per the discussion Jan 3, 2017, the IBIS Specification makes this statement
on page 123:
The [Pin Mapping] keyword cannot be used with [External Circuit] in the
same [Component] description.
If [Pin Mapping] is legally used with [Define Package Model] (and optionally
for [Model] and [External Model]), the [Interconnect Model] description is
limited to all cases where bus_label is not declared or implied (e.g., not
using Buffer_Rail). A broader statement would expand the page 123 rule:
The [Pin Mapping], [Bus Label], or [Die Supply Pads] keywords cannot be
used with [External Circuit] in the same [Component] description.
There may be [Interconnect Model Set Selector] (that call [Interconnect
Modes]s that do not interact (such as with direct pin_name routing to
explicit buffer terminals (e.g. pullup_ref). However, it is simpler to
expand the rule and not deal with special case logic.
Bob
--
Bob Ross
Teraspeed Labs
www.teraspeedlabs.com <http://www.teraspeedlabs.com/>
bob@xxxxxxxxxxxxxxxxx
Direct: 503-246-8048
Office: 971-279-5325
