Hi Michael,
In IBIS_ISS you can create a subcircuit with as many S-elements as you wish and
connected as desired. Then you can use that subcircuit in the interconnect
model.
Radek
From: ibis-interconn-bounce@xxxxxxxxxxxxx <ibis-interconn-bounce@xxxxxxxxxxxxx>
On Behalf Of Mirmak, Michael
Sent: Thursday, January 27, 2022 9:52 AM
To: IBIS-Interconnect <ibis-interconn@xxxxxxxxxxxxx>
Subject: [ibis-interconn] IBIS-ISS question
CAUTION: This message originates from an external sender.
The current IBIS-ISS format definition supports W-elements for RLGC structures
and S-elements for Touchstone S-parameters. However, in some commercial
flavors of SPICE today, the two can be combined (i.e., W-elements can "wrap
around" S-parameters).
1. Is there a reason why this particular feature was *not* included in
IBIS-ISS? Was this an oversight or a deliberate omission?
2. In the absence of this feature, IBIS-ISS has a significant limitation,
which the new IBIS Interconnect Model does not alleviate: cascading instances
of S-parameters is not supported.
S-parameters can and are used to represent unitary circuit elements (for
example, a solder pad), but are also used to represent scalable structures (for
example, a portion of PCB trace modeled as a transmission line). The "M"
structure for subcircuits supports easy *parallel* connection of elements, but
without a W-element wrapper, I don't see a way to easily cascade multiple
S-parameter elements in series. Is there any known way using existing IBIS-ISS
structures to do this? If not, would a change to IBIS-ISS to support this be
feasible (without a parser, this seems not very burdensome).
Thanks in advance...
* MM
