[ibis-interconn] Re: IBIS Interconnect Task Group Meeting

From: <radek_biernacki@xxxxxxxxxxxx>
To: <michael.mirmak@xxxxxxxxx>, <ibis-interconn@xxxxxxxxxxxxx>
Date: Wed, 3 Dec 2014 01:15:19 +0000
Hi Michael,

Again, I have a conflict and will not be able to join the meeting tomorrow.

However, I still need to fix my Lync Web App Plugin to be able to view anything 
that is shared. It looks like I have an older version 5.0.8308.577 installed on 
my PC. The only source of that old installation was our Interconnect meetings 
some time ago. Whenever (during our current meetings) I try to install the new 
version 15.8.8308.577 the old one cannot be uninstalled. It complains that it 
cannot find its own (old) installation package, which I must have lost it, or 
never saved. If I point to the new installation package (downloaded during our 
recent meetings) "LWAPlugin64BitInstaller32.msi" my current installation that I 
want to uninstall complains understandably that it is not a valid installation 
package.

If it is not too much trouble, could you check with your IT whether they have 
the installation package for that older version, so that I could use it to 
uninstall the old version? Then hopefully, I could install the new version 
without any problems.

Thanks ,
Radek


-----Original Appointment-----
From: Mirmak, Michael [mailto:michael.mirmak@xxxxxxxxx]
Sent: Sunday, November 30, 2014 3:43 PM
To: IBIS-Interconnect (ibis-interconn@xxxxxxxxxxxxx)
Subject: [ibis-interconn] IBIS Interconnect Task Group Meeting
When: Wednesday, December 03, 2014 8:00 AM-9:00 AM (UTC-08:00) Pacific Time (US 
& Canada).
Where: teleconf.



======================================================================
IBIS INTERCONNECT TASK GROUP
http://www.eda.org/ibis/interconnect_wip/

Mailing list: 
ibis-interconnect@xxxxxxxxxxxxx<mailto:ibis-interconnect@xxxxxxxxxxxxx>
Archives at //www.freelists.org/archive/ibis-interconn/

======================================================================
Wednesday, November 26, 2014
8 AM US Pacific Time

Objective: produce a unified package improvement proposal (BIRD) for 
consideration by the IBIS Open Forum that satisfies industry package and on-die 
interconnect modeling requirements

Agenda:
1) Roll call
2) Call for patent disclosures
3) Opens
4) Review drawings for model/package/on-die interconnect structure

AR List for IBIS Interconnect Document
1) Pin Mapping treatment (Michael)
2) Pre-layout vs. post-layout notation (Walter)
3) Rules of precedence for different package modeling methods (Walter)
4) Interaction with Circuit Call and External Circuit (Arpad)
5) Unused Terminal text (Brad) - to be reviewed
6) Die Supply Pads (Walter) - to be reviewed
7) Examples on page 15 in red to be removed (Walter) - to be reviewed
8) Define Package Model - to be rolled into rules of precedence
9) New Buffer Power Mapping keyword (Walter)
10) Editorial scrub

.........................................................................................................................................
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[ibis-interconn] Re: IBIS Interconnect Task Group Meeting

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