Geoff, I would agree. A single inductance value for a via is not of much use, due to it's narrow bandwidth. Sometimes it is possible to create a T-line model of a via, to efficiently model it's reflection behavior, but that too falls short, since it does not model losses in the cavity. In the end, the only reasonable way I have found to model via is through a 3D full wave solver which produces broadband s-parameters. As others have discussed, the via is modeled out to the exit traces, in a region where the fields patterns have stabalized. In addition, the area modeled across the planes is dependent upon the surrounding via pattern for grounds, power and other signals. Open boundaries in the plane x and y directions are used to simulate energy that is lost in the cavity, but this is only an approximation, since any energy that returns back from the edges of the planes will couple back into the excited via. best regards, scott -- Scott McMorrow Teraspeed Consulting Group LLC 121 North River Drive Narragansett, RI 02882 (401) 284-1827 Business (401) 284-1840 Fax (503) 750-6481 Cellular http://www.teraspeed.com Teraspeed is the registered service mark of Teraspeed Consulting Group LLC ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl?Si-List_FAQ List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu