[SI-LIST] Re: Thermally Conductive Adhesives
- From: Arjun Bingipur <Arjun.Bingipur@xxxxxxxxxxxxxxxxx>
- To: brian@xxxxxxxxxxxxxxxxxx
- Date: Fri, 6 Jan 2012 12:24:07 +0000
As I understand from the link below, it is treated as an alternative to
copper heat sink.
http://www.atotech.com/products/electronics-materials/surface-protection/heatsink-paste.html
Regards,
Arjun
Brian Rautio <brian@xxxxxxxxxxxxxxxxxx>
06/01/2012 12:01
To
Arjun Bingipur <Arjun.Bingipur@xxxxxxxxxxxxxxxxx>
cc
"<si-list@xxxxxxxxxxxxx>"
Subject
Re: [SI-LIST] Thermally Conductive Adhesives
Not really an SI question but an easy answer.
The information you're looking for is limited (or non-existent) because
the application isn't as you are thinking. Thermal paste is not a
replacement for "conventional copper heatsinks," but rather an agent used
to fill in any air gaps resulting from roughness in the interface between
a die/IC/package/etc. and the heatsink material itself. Without it, such
air gaps serve as an unfortunately good thermal insulator. Some thermal
pastes include an epoxy or adhesive to mechanically fasten the heatsink as
well.
Thanks,
Brian
On Jan 6, 2012, at 6:48 AM, Arjun Bingipur wrote:
> Hi,
> I would like to ask the experts a question at the risk of it being
non-SI
> related.
>
> I'm in the process of evaluating Heat Sink Paste technology instead of
> conventional copper heat sinks.
>
> Although there are very good technical papers on thermally conductive
> adhesives and various other technical specifications, the information is
> quite limited when it comes to actual application.
>
> I would like to hear from the group if there are any real time success
> stories used in mass production? Failure modes? Trade offs? Any one
tried
> it especially in the Automotive industry?
>
> Any information will be much appreciated.
>
> Regards,
> Arjun
>
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