[SI-LIST] Signal Integrity Job Opportunities at Broadcom
- From: Sam Karikalan <sam_karikalan@xxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Fri, 15 Sep 2006 10:29:18 -0700 (PDT)
Broadcom Corporation has openings for the position of
Signal Integrity Engineer in its IC Packaging Group.
The job requirements are as follows:
Job Requirements : MSEE is required, Ph.D. EE
desired. Sound understanding of electromagnetic theory
and fundamentals with at least seven (7) years
experience with electrical modeling tools such as
ANSOFT, Speed2000, HFSS, and other related tools.
? Extensive experience with signal integrity and
microwave transmission line theory (both frequency and
time domain)
* Hands-on experience with experimental methods such
as TDR and S-parameter measurement is required .
Description : Individual with outstanding electrical
simulation and performance characterization skills who
will be guiding the design, development, and
definition of substrates, validation of power
delivery, signal integrity, clock distribution and
high speed signal routing on Silicon, Package
substrates, and PCBs for the state of the art
communication systems chips, microprocessors and
chipsets.
-The candidate must be able to direct the design teams
and coordinate the design efforts for proper chip
padring and package ballout assignment.
-The candidate should have proper skills to interact
with customers and get their requirements and make
sure the products meet the specifications.
-The candidate must be able to define product
requirements and specifications, together with
customers, based on applicable standards, and support
customer products and subsystem characterization.
Interested persons may e-mail their resume to me at
samk@xxxxxxxxxxxx or call me at 480-235-1368.
Best Regards,
Sam Karikalan
Broadcom Corporation
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