[SI-LIST] SPI 2006 - Call for Papers

Please consider the following announcement and accept our apologies in case of 
multiple copies. 

Call for Papers
10th IEEE WORKSHOP ON
SIGNAL PROPAGATION ON INTERCONNECTS

Sponsored by the IEEE Computer Society -- Test Technology Technical Council 
(TTTC)
and by the IEEE Components, Packaging, and Manufacturing Technology (CPMT) 
Society

May 09-12, 2006
Dorint Sofitel Schweizerhof Berlin, Berlin-Mitte, Germany

http://www.spi.uni-hannover.de


Deadlines 
- Paper Submission: January 31, 2006 
- Notification of Acceptance: March 14, 2006 

Paper Submission 
Those who wish to contribute to the workshop should send (by e-mail only) a 
formatted paper of up to four pages to the Program Chair by January 31, 2006 
(please see the submission instructions on our website 
http://www.spi.uni-hannover.de and use the author's kit provided there to 
ensure a consistent layout). If the paper is accepted, it will be reproduced, 
as is, in the workshop proceedings. Notification about acceptance will be given 
by March 14, 2006. 

Main topics of the workshop will include, but are not limited to: 
- Frequency Domain Measurement Techniques 
- Time Domain Measurement Techniques 
- Modeling Techniques of Package & On-Chip Interconnects 
- Macro-Modeling 
- Simulation Techniques for Interconnect Structures 
- Electromagnetic Field Theory 
- Analysis and Modeling of Power Distribution Networks 
- Propagation Characteristics on Transmission Lines 
- Coupling Effects on Interconnects 
- Substrate Effects 
- Guided Waves on Interconnects 
- Radiation & Interference 
- Electromagnetic Compatibility 
- Power/Ground-Noise 
- Testing & Interconnects 
- Optical Interconnects 


Workshop Standing Committee: 
Flavio G. Canavero, Politecnico di Torino, Dipartimento di Elettronica, Torino 
(I); 
canavero@xxxxxxxxx 

Hartmut Grabinski, Univ. Hannover, Laboratorium fuer Informationstechnologie, 
Hannover (D); 
grabinski@xxxxxxxxxxxxxxxxxxx 

Michel S. Nakhla, Carleton University, Department of Electronics, Ottawa (CAN); 
msn@xxxxxxxxxxxxxxx 

Jose E. Schutt-Aine, Univ. of Illinois at Urbana-Champaign, Center for Comp. 
Elm., Urbana (USA); 
jose@xxxxxxxxxxxxxx 

Madhavan Swaminathan, 
Georgia Institute of Technology, 
Atlanta (USA); 
madhavan.swaminathan@xxxxxxxxxxxxxx 

Chair: 
Hartmut Grabinski, Laboratorium fuer Informationstechnologie, Schneiderberg 32, 
30167 Hannover (Germany) Phone +49-511-762-5030; Fax +49-511-762-5051 
grabinski@xxxxxxxxxxxxxxxxxxx 

Program-Chair: 
Uwe Arz, Physikalisch-Technische Bundesanstalt, High-Frequency Measurement 
Group (2.22), Bundesallee 100, 38116 Braunschweig (Germany) Phone 
+49-531-592-2297; Fax +49-531-592-2228 
uwe.arz@xxxxxx 


Technical Program Committee: 
R. Abhari, Univ.McGill (Ca)
T.R. Arabi, Intel (USA)
W. Bandurski, Univ. Poznan (PL)
A. Cangellaris, Univ. Illinois (USA)
J.L. Carbonero, ST (F)
E. Chiprout, Intel (USA)
D. Deschacht, Univ. Montpellier II (F)
A. Deutsch, IBM (USA)
T. Dhaene, Univ. of Antwerp (B)
E. Griese, Univ. Siegen (D)
H.-J. John, Siemens VDO Automotive AG (D)
R. Khazaka, Univ.McGill (Ca)
G. Katopis, IBM, Poughkeepsie (USA)
I. Maio, Politecnico di Torino, Torino (I)
J. Niehof, Philips Research Laboratories (NL)
P. Nordholz, Infineon, Munich (D)
N. van der Meijs, Univ. Delft (NL)
H.J. Pfleiderer, Univ. Ulm (D)
J.L. Prince, Univ. of Arizona, Tucson (USA)
B. Ross, Teraspeed Consulting Group, (USA)
A. Rubio, Univ. UPC Barcelona (E)
A.E. Ruehli, IBM, Yorktown Heights (USA)
E. Sicard, INSA, Toulouse (F)
G. Sommer, Fraunhofer IZM, Berlin (D)
A. Weisshaar, Oregon State Univ. (USA)
T.M. Winkel, IBM, Boeblingen (D)

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