[SI-LIST] Need your Opinion and expertise
- From: "Eoin Mc Gibney" <emcgibney@xxxxxx>
- To: <si-list@xxxxxxxxxxxxx>
- Date: Thu, 20 Jul 2006 17:02:07 +0100
Dear Amir Nader-Tehrani,
As has been shown by Hassan, Celine and Abe many methods exist to
characterise a connector, I would agree with Hassan that trying to measure
and dembed s-parameters for a multi terminal connector in mated
configuration is quite difficult and if you are only starting out in signal
intgrity you may not have alot of experience with de-embedding, vna
calibration, test fixture design. As Abe suggested using TDR measurements
could be a simpler approach, a good paper on the modeling of a high
density/high speed connector is:
Sreemala Pannala, "Parameter Extraction and Electrical Characterisation of a
High Density Connector using Time Domain Measurements" IEEE Trans. on Adv.
Packaging Vol. 22 No.1 Feb 1999.
Abe suggested using IConnect software to extract the equivalent circuit, you
would need a licence for this software but using the measured impedance
profile and a circuit topology suitable for the interconnect, a spice
simulation can be optimised to fit the measured and simulated profiles. This
might be a good approach if you want to get a hands on feel for model
extraction. I will send you an overview paper offline that i did which has
supplimentary references to help with your modeling.
It all depends on what about the connector you want to model? what
frequencies/risetimes are involved? what equipment/software tools you have
available to you?
A good place to look at too is Samtecs website www.samtec.com, they have
some existing spice models which you could try simulate, also you could get
a sample/buy a connector from them and try model it yourself and compare it
to samtecs model.
Regards,
Eoin Mc Gibney
=================================
Eoin Mc Gibney
Dept. of Electronic Engineering
Centre for Adaptive Wireless Systems
Cork Institute of Technology
Bishopstown
Cork
Ireland.
Ph: +353 21 4326859
=================================
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