[SI-LIST] LICA in flip chip BGAs

From: Yuan Li <YSLI@xxxxxxxxxx>
To: si-list@xxxxxxxxxxxxx
Date: Mon, 23 Jul 2001 09:46:35 -0700

I need your advice. Any information would be helpful.

I will look into the dimension feasibility of putting LICA in the FC
packages.  Some questions need to be answered such as: What is the clearance
between the edge of the die to the edge of heat spreader we need for LICA?
How about the thickness of LICA vs. the heat spreader?  I use uF range of
LICA.
Thanks,

Yuan

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[SI-LIST] LICA in flip chip BGAs

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