[SI-LIST] High performance materials
- From: Chris Mesibov <Chris.Mesibov@xxxxxxxxxxxxxxx>
- To: SI list <si-list@xxxxxxxxxxxxx>
- Date: Tue, 10 Jul 2001 08:05:24 -0400
Does anyone know of any studies detailing justification for using high
performance PCB materials on boards other than back planes? I am
concerned with thermal stability and group delay issues with using FR4
on boards implementing data rates up to and beyond 2 Gb/s.
Regards,
--
Chris Mesibov
Sr. Hardware Engineer Fujitsu Network Communications, Inc.
Phone:(845)731-2037 2 Blue Hill Plaza, 6th Floor
Fax: (845)731-2011 Pearl River, NY 10965
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