Augusto Einsfeldt wrote: > I am involved in a design where a large board (7"x11") may work at -40C most > of the time while, for 1 to 2 hours, few times a day, goes to +40 and stay > there for this time. > My concern is the care I have to take while drawing the board to cope with > contractions and expansions, and also if there are other concerns like > snip < I'd expect your primary issues to be solder joint fatigue and PTH failures. In general for Hi-Rel product you should be specifying properly both bare board and assembly, IPC &/or JSTD Class 3. You should probably be talking with your manufacturing and physical design resources, for their opinions on specifics. For the solder, if you have BGA components you should be using an underfill. Gullwing or Through-Hole are not an issue so long as the joints are formed properly (driven by specifications above). I've seen a couple of tricks to help discrete components but these will again depend on those who assemble and their capabilities. For the vias, consider building your boards with additional copper plate in the holes, and be gentle on the aspect ratio with respect to your fabricators' capabilities. With these measures FR4 should be fine. -- Jeff Seeger Applied CAD Knowledge Inc Chief Technical Officer Tyngsboro, MA 01879 jseeger "at" appliedcad "dot" com 978 649 9800 ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu