Lee Ritchey wrote: >All of those reasons, except the flex circuit one, went by the wayside many >years ago. Wonder why they still linger around the industry like old socks! > Agreed venting and bonding concerns first appeared in 60s military specs but I'll wager that if you were to chat up a substrate foundry there is current call for venting. On the bonding front we were recently asked to provide some "hatch", understood to be for laminate to laminate, in an area of a board lacking vias. The board involved fussy materials and a challenging end-use environment. I don't believe it was an offhanded request. We'll simply have to agree to disagree on cross hatching as a way to work with supply- and signal- dense areas to minimize the layer count *and* bow and twist. I'd be happy to debate further but suggest IPC's Technet as a more appropriate forum for the bandwidth on DFM issues. Old socks can become new again, it can be useful to recall where we put them. Respectfully, -- Jeff Seeger Applied CAD Knowledge Inc Chief Technical Officer Tyngsboro, MA 01879 jseeger "at" appliedcad "dot" com 978 649 9800 ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu