Hi experts :: While designing a multilayer PCB if all the left over area (after the routing and etc is done) is grounded by filling copper, what kind of impact is it going to have on a) purely digital boards b)Mixed signal boards with separate analog and digital power planes,c)RF boards. Pls explain in detail if there is any bench mark to decide whether or not go for copper filling in the unused areas.Or is there any tool which could help us decide this. Best Regards -- suresh ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl?Si-List_FAQ List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu