[SI-LIST] Re: Broadside coupled line vertical registration
- From: Scott McMorrow <scott@xxxxxxxxxxxxx>
- To: Dennis.Han@xxxxxxxxxxx
- Date: Thu, 05 May 2005 12:29:11 -0400
Dennis,
HSPICE does. You can use the monte carlo capability to vary the
dimensional parameters for the field solver. However, it is not hard to
identify the tolerance extremes for Broadside differential pairs by
inspection.
regards,
Scott
Scott McMorrow
Teraspeed Consulting Group LLC
121 North River Drive
Narragansett, RI 02882
(401) 284-1827 Business
(401) 284-1840 Fax
http://www.teraspeed.com
Teraspeed® is the registered service mark of
Teraspeed Consulting Group LLC
Dennis Han wrote:
>Does anyone know if any simulator has Monte Carlo or a similar =
>statistical
>capability? It would make a task such as this easier.
>
>Dennis
>
>
>-----Original Message-----
>From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] =
>On
>Behalf Of Bill Wurst
>Sent: Thursday, May 05, 2005 10:07 AM
>To: si-list@xxxxxxxxxxxxx
>Subject: [SI-LIST] Re: Broadside coupled line vertical registration
>
>
>Mark,
>
>While you are evaluating the effects of copper registration, don't=20
>forget to also include the effect of manufacturing variations in the=20
>thickness of the three dielectrics: top plane-to-trace, trace-to-trace, =
>
>and bottom plane-to-trace. Each one will have an impact, the degree of=20
>which is dependent upon the relative spacing and the amount of variation =
>
>relative to the nominal thickness, as well as the width of the traces.
>
>Regards,
>
> -Bill
>
>
> /************************************
> / billw@xxxxxxxxxxx /
> / /
> / Advanced Electronic Concepts, LLC /
> / www.aec-lab.com /
> ************************************
>=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
>=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D
>Ed Sayre III wrote:
>
>
>>Mark,
>> Try using a free ware field solver for this. It is a simple=20
>>experiment
>>and you will surprised by the results.
>> We have done some substantial investigations into this and found =
>>
>>
>that=20
>
>
>>the broadside registration is not as sensitive to variations as edge=20
>>coupled spacing and dielectric thicknesses. Of course the issue is =
>>
>>
>the=20
>
>
>>level of coupling for the lines. The tighter the mutual coupling the =
>>
>>
>more
>
>
>
>>critical the registration. Thus try your stack and see.
>>=20
>>Regards
>>-Ed
>>=20
>>=20
>>=20
>>=20
>>At 02:37 PM 5/5/2005 +0100, Mark Burford wrote:
>>=20
>>
>>
>>>I have an interesting query, I would like to know what you guru's=20
>>>think about the effect of the vertical alignment of a broadside=20
>>>coupled trace and the error it could potentially introduce to 2D field =
>>>
>>>
>
>
>
>>>solvers and the traditional transmission line approximation formulas=20
>>>for calculating Z0, C and L. To clarify: a perfect alignment I am=20
>>>classing as both lines exactly stacked one above the other with with=20
>>>core material in the centre an no over hang, worst case would be one=20
>>>line being offset to the left or right by 50 percent.
>>>
>>>Could the potential error introduced be described to a first order by=20
>>>decreasing the capacitance by at worst case 0.5? What would be the=20
>>>2nd order effects?
>>>
>>>Your thoughts I am sure will be as diverse as they are interesting.
>>>
>>>Thanks guys
>>>
>>>Mark Burford=3D20
>>>EngD Research Engineer
>>>
>>>------------------------------------------------------------------
>>>
>>>
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