[pcbforum] Embedded Components - An Outlook
- From: "BS, Yashavanth" <yashavanth_bs@xxxxxxxxxxx>
- To: "'pcbforum@xxxxxxxxxxxxx'" <pcbforum@xxxxxxxxxxxxx>
- Date: Fri, 30 May 2003 19:16:17 +0530
Hello all,
Electronics companies are seeing an increased use of embedded components
in their PCB designs. Embedded components are fabricated into a printed
circuit board and allowed on internal and surface layers. There are
several factors driving the trend to use of embedded components over
discrete components.
Increased functionality of active devices has the number of passive
components growing. The number of discrete passive components is, in
many cases 70 to 80% of the total part count and continues to rise as
passive-to-active ratios grow. While active devices are being packaged
into large pin Ball Grid Arrays (BGAs) the ideal surface placement space
for discrete passive components becomes more difficult to obtain.
Also, increased numbers of capacitors are needed as device speeds and
digital content increases. Capacitors must be placed close to the IC pin
to avoid unacceptable noise or timing delays. Eliminating discrete
passive components from the surface layers and embedding them, thus
frees surface space and allows the passive devices to be closer to
active pins.
Embedded passive components allow for higher frequency (faster) PCBs.
The linearity of signals through embedded passive components reduces
inductance of "core to surface, return to core" signal paths. Along with
lower inductance, embedded passive components can lower power system
impedance and radiated emissions - improving the overall electrical
performance of a PCB. Also, reliability of the PCB is improved through
reducing the overall number of solder joints.
For leading-edge companies, there is also the need for embedded active
devices. While additional surface space is made available for other
active devices, embedded active devices are not packaged, leading to
smaller footprints for the active device. The driving factor to use
embedded active devices is reduction in the PCB size format while
increasing the active functions.
Regards,
Yeshu
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