[PCB_FORUM] Re: Multi-layer stackup design
- From: "Jose Magnaye" <josemagnaye4@xxxxxxxxx>
- To: icu-pcb-forum@xxxxxxxxxxxxx
- Date: Wed, 22 Feb 2006 10:51:48 +0800
Hi Claude
We're trying to design it to be as generic as possible since we will be
using several vendors. They can define which materials they can use for the
prepeg but the stackup design should be fixed.
Basically what we are trying to determine if 0.2mm thickness will be enough
for the 3 layer prepeg to withstand at least 1.5KV.
On 2/22/06, Claude Meyers <claude.meyers@xxxxxxxxxxxxxx> wrote:
>
> This is a question you should be asking your fabrication house. Every PCB
> Fab house has different requirements.
>
>
> ------------------------------
>
> *From:* icu-pcb-forum-bounce@xxxxxxxxxxxxx [mailto:
> icu-pcb-forum-bounce@xxxxxxxxxxxxx] *On Behalf Of *Jose Magnaye
> *Sent:* Tuesday, February 21, 2006 6:00 PM
> *To:* icu-pcb-forum@xxxxxxxxxxxxx
> *Subject:* [PCB_FORUM] Multi-layer stackup design
>
>
>
> Hi!
>
>
>
> We are designing an AC-DC power supply on a 4 layer board and we are
> currently looking at any literature on how to design the stack-up.
>
>
>
> Some of our primary and secondary tracks overlap and we were told that we
> can let them overlap as long as we use 3 prepeg layers in between.
> Unfortunately, we cannot find any info on the minimum allowed thickness of
> the 3 layers.
>
>
>
> We are concerned with the thickness since we will be using a 1.6mm 4 layer
> FR4 board with 2 Oz copper on all layers.
>
>
>
> JM
>
>
>
>
>
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