[PCB_FORUM] Re: Multi-layer stackup design
- From: "Claude Meyers" <claude.meyers@xxxxxxxxxxxxxx>
- To: <icu-pcb-forum@xxxxxxxxxxxxx>
- Date: Tue, 21 Feb 2006 18:37:40 -0800
This is a question you should be asking your fabrication house. Every
PCB Fab house has different requirements.
________________________________
From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of Jose Magnaye
Sent: Tuesday, February 21, 2006 6:00 PM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] Multi-layer stackup design
Hi!
We are designing an AC-DC power supply on a 4 layer board and we are
currently looking at any literature on how to design the stack-up.
Some of our primary and secondary tracks overlap and we were told that
we can let them overlap as long as we use 3 prepeg layers in between.
Unfortunately, we cannot find any info on the minimum allowed thickness
of the 3 layers.
We are concerned with the thickness since we will be using a 1.6mm 4
layer FR4 board with 2 Oz copper on all layers.
JM
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