[ibis-macro] We need to define terms System, Component, Connected, Connection, Module, .ibs Package and Die, .ibs Bare Die
- From: "Walter Katz" <wkatz@xxxxxxxxxx>
- To: "IBIS-ATM" <ibis-macro@xxxxxxxxxxxxx>, "IBIS-Interconnect" <ibis-interconn@xxxxxxxxxxxxx>
- Date: Fri, 8 Feb 2013 11:00:17 -0500 (EST)
All,
There has been two much confusion on what EMD is and a comprehensive .ibs
package and on-die interconnect solutions, so I propose the following
definitions to clarify future discussions.
System
A system consists of multiple components that have electrical connections
between them.
Component
A basic building block of a System. A component can be a backplane, PCB,
Connector, Cable, DIMM component, Multi Chip Module, Interposer, package,
a packaged die, a bare die, and other things that have not been invented
yet.
Connection
Two electrical nodes in a system are connected if the Insertion Loss
between the two points at Nyquist is "Small".
Connection
A connections consists of a list of electrical nodes that are all
connected to each other.
Module
A Module is a Component that has Pins that connect to other system
components, and contains Components and Connections between these
Components, and between these Components and the Module's Pins.
EMD
One proposed solution that describes Interconnect Subckts between the
Module Pins and/or Module Components Pins
IBIS Component
Represented by a .ibs file, contains one, and only one die, [Models],
package interconnect between the [Component] [Pins] and Die Pads, on-die
interconnect between the die pads and the [Model].
Bare Die IBIS Component
A special case IBIS Component that represents a physical Die that is
mounted directly in a Module. An example of this is a multi-chip module
(MCM) that contains two are more die that are mounted and wire bonded
directly on the MCM surface. The [Pin] and on-die pad are at the same
location, and the Package model should be treated as a zero ohm resistor.
Interconnect Subckt
An IBIS-ISS subckt or a Touchstone File that has ports that as described
below. The ports may or may not be connected to all of the other ports.
Module
Pins
Component Pins
IBIS Package
Pins
Die Pads
On-Die Interconnect
Die Pads
[Model] ports
Note that a Module (and therefore EMD) never has connections to [Model]!!!
Walter
Walter Katz
<mailto:wkatz@xxxxxxxxxx> wkatz@xxxxxxxxxx
Phone 303.449-2308
Mobile 303.335-6156
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- » [ibis-macro] We need to define terms System, Component, Connected, Connection, Module, .ibs Package and Die, .ibs Bare Die - Walter Katz
