[SI-LIST] Sr. Signal Integrity Application Engineer for Molex Inc (China)

From: satish pratapneni <satishp@xxxxxxxxx>
To: si-list@xxxxxxxxxxxxx
Date: Wed, 24 Mar 2010 08:50:38 -0700 (PDT)

Fellow SI experts,

We are looking for senior level signal integrity application engineers for 
Molex Inc. 
The position is located in China. The description is given below. 
If you or someone you know might be interested, please send your resume 
or contact me directly.

Best Regards,

Satish Pratapneni

Signal Integrity Architect
Commercial Products Division
Molex Inc.

spratapneni@xxxxxxxxx

(408) 624-1769 (ext 603 if asked)


Job Description
 
Sr. Signal Integrity Application Engineer
 
Leading interconnect system company is looking for a go-getter personality to 
lead efforts of working with customers in defining their next generation high 
speed physical layer connectivity. The successful candidate will be part of 
signal integrity application team and participate in the definition of customer 
system interconnects. This individual will be part of a larger team with 
designers, mechanical and process engineers in creation of next generation 
interconnect products. 

Your responsibilities will include but not be limited to: 

- Working with customers on various high-speed serial I/O, Back plane and 
signal applications 
- Developing unique interconnect solutions based on customer objectives of 
performance and cost for overall channel
- Selection of appropriate signaling and interconnect technology for high 
performance links
- Simulating and/or analyzing the overall link to develop the sensitivity of 
each piece of physical layer 
- Generating the routing requirements and electrical margins for specific 
interfaces and verifying their correctness 
- Root causing any issues in existing channels for customers
- Designing and conducting detailed testing and measurements to collect data 
for validation and correlation of design analysis 
- Through correlations platform and test boards capture variations of 
interconnect pieces which can be used in overall link simulations
- Making recommendations for improvement of interconnect systems (connectors 
and cable assemblies) designed by central design teams
- Perform detailed design reviews for customers and provide recommendations
- Making recommendations to modify lab equipment and/or processes to establish 
or improve process feasibility and/or capability and increase efficiency
- Through analysis come up with guidelines to mitigate EMI from interconnect 
systems
- Come up with effect of connectors (which are part of power distribution 
network (PDN) of customers) on overall AC or DC performance of PDN
- Work with front end tools/applications which are meant to capture customer 
requirements and provide design specific recommendations
- Develop supporting documents / application notes for customers
 
 
Skills Required:
 
Proficiency with statistical and time domain serial link simulation 
techniques/methods, field-solver and  familiarity with high speed serdes 
design, architectures, protocols and modeling methods of high-performance I/O 
technologies. In depth understanding of electromagnetics is essential. 
Experience with available CAD/CAE tools such as Channel Designer, HFSS, CST, 
FDTD tools, MoM tools,  Sigrity PowerSI, PAKSI-E, Power-grid, Agilent ADS, 
Agilent PLTS, Cadence CAD tools or related tools a plus. Experience correlating 
simulation results with lab measurements using oscilloscopes, TDRs, VNAs, and 
spectrum analyzers is essential. Capability of scripting/automating the 
analysis flow with point tools is a plus. Self motivation, teamwork and strong 
communication skills are essential.
 
Education:
 
Bachelor’s degree in EE with 8+ years (OR MSEE/PhD with 5+ yrs) of experience 
in relevant area of designing and supporting high speed electrical interconnects



      
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[SI-LIST] Sr. Signal Integrity Application Engineer for Molex Inc (China)

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