[SI-LIST] Re: RF via
- From: Dan Swanson <DSWANSON@xxxxxxxxxxxxx>
- To: 'Alex Horvath' <alexh@xxxxxxxxxxxxxxxx>, perry.qu@xxxxxxxxxxx,Dan Swanson <DSWANSON@xxxxxxxxxxxxx>
- Date: Tue, 25 Sep 2001 08:26:03 -0400
Alex,
In your original post I thought you were looking for
RF grounding. This sounds like you are talking about
a signal via. If so:
1. You need a path for the return current close to the
signal via. If you have room, you can place ground
vias around the signal via to form a vertical transmission
line in the board. Controlling this impedance gets more
critical as the board gets thicker and the frequency goes
up.
2. The size and distribution of pads and anti-pads can be
designed.
3. In general, transitions from microstrip into the via tend
to be inductive. Leave the pad in the groundplane layer
in place and minimize the anti-pad dia. You actually want
extra capacitance to compensate the inductance.
4. In general, stripline transitions tend to have excess capacitance.
So you remove the pad or pads in the adjacent ground plane
layers and increase the anti-pad diameter.
5. I do this on a field-solver by optimizing for return loss across
the frequency range of interest.
I have used this general approach for transitions up to 10 GHz and
up to 16 layers.
Dan
Dan Swanson EMAIL: d.swanson@xxxxxxxx
Bartley RF Systems, Inc. TEL: 978-834-4085
37 South Hunt Road FAX: 978-388-7077
Amesbury, MA 01913
On Monday, September 24, 2001 6:23 PM, Alex Horvath
[SMTP:alexh@xxxxxxxxxxxxxxxx] wrote:
> I found a source that describes an RF via (which is bad terminology, I
know)
> as follows:
>
> 1. Large anti-vias (do they really mean anti-pads).
> 2. No pads on power and ground planes.
> 3. No pads on signal planes that are not used.
>
>
>
> -----Original Message-----
> From: si-list-bounce@xxxxxxxxxxxxx
> [mailto:si-list-bounce@xxxxxxxxxxxxx]On Behalf Of Perry Qu
> Sent: Thursday, September 20, 2001 9:54 AM
> To: DSWANSON@xxxxxxxxxxxxx
> Cc: 'alexh@xxxxxxxxxxxxxxxx'; Si-List
> Subject: [SI-LIST] Re: RF via
> Importance: High
>
>
>
> Hi!
>
> I would imagine that RF via is similiar to a coax structure, where you
have
> several return vias surrouding the signal vias. This is to match 50 ohm
> impedance as close as possible and reduce the discontinuity effect of the
> vias.
>
> Regards
>
> Perry
>
> Dan Swanson wrote:
>
> > Physically short, close to the component.
> > Lowest impedance path possible to true ground,
> > not the local ground. Via always has some
> > finite inductance.
> >
> > Dan
> >
> > On Wednesday, September 19, 2001 5:14 PM, Alex Horvath
> > [SMTP:alexh@xxxxxxxxxxxxxxxx] wrote:
> > >
> > > What are the particulars of a "rf via"?
> > >
> > > I'm using a component which switches at 2 Ghz that recommends the use
of
> > > this type of via.
> > >
> > >
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> --
> Perry Qu
>
> Product Integrity | 600 March Road
> Alcatel Canada | Ottawa, ON K2K 2E6, Canada
>
> DID: (613) 7846720 | FAX: (613) 5993642
>
>
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