[SI-LIST] Fab capabilities
- From: sunil bharadwaz <sunil_bharadwaz@xxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Wed, 6 Dec 2006 09:49:43 -0800 (PST)
Hello friends ,
We have a BGA chip with 0.3 mm pitch & 0 .1 mm ball dia.
Obviously it is difficult to route the inner row balls.Targeting
a two layer card.
I wanted to understand
1)What is the smallest Dia Via & pad possible with the Fab houses.
2)Thinnest tracks possible & the min clearances required.
3)List of Fab houses who have these kind of capabilities
(Any where in the world).
Appreciate any help in this regards.Thanks !!
Best regards
Sunil B
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