Dear Members,
The 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) will be
held from May 8 to May 11, 2016 in Turin, Italy.
On behalf of the SPI 2016 Standing Committee, it is my pleasure to invite
you and your colleagues to contribute papers, talks, exhibitions to the
event. Over the past nineteen years, SPI has evolved into a forum of
exchange on the latest research and developments on design,
characterization, modeling, simulation and testing for Signal and Power
Integrity at chip, package, board and system level.
Please check the official website www.spi2016.org for more information
regarding the technical program, venue, traveling and lodging information.
This call for papers is also available at http://www.spi2016.org/cfp.asp.
[Highlights]
- Conference papers published on IEEE Xplore
- Special section of the IEEE Transactions of Components, Packaging and
Manufacturing Technology reserved to best-ranked papers
- "Industry Forum" with both invited and contributed talks from the industry
- Keynote speeches and tutorials on emerging research topics
- Best Student Paper Award
- European IBIS Summit
I am looking forward to seeing you in Turin!
Sincerely,
Prof. Stefano Grivet-Talocia
SPI2016 General Chair
chair@xxxxxxxxxxxxxxxxx
