Hi Si-List PCB design experts. If I had a large buried capacitance layer, a vcc and ground, and stuck a single part in the center of it requiring decoupling, how much capacitance would the vcc pin of the part actually "see"? Is this a distributed capacitance? I know that they say to use a rule of thumb like 500 pF/in2. But for each square inch of buried capacitance that I use does the sum add linearly? In my case, I am considering using a buried capacitanc layer in a pcb where the switching is done at 4Gb/s. I have several circuits that are identical but not running on the same supply, so the area of buried capacitance will not be all that large. My original concept is to use a small section of buried plane for high speed switching and have some larger decoupling caps (.01 uF 402) connected through vias to make up for what the plane can not handle at lower frequencies. Now if I use, say, a square inch of buried plane per device, that would amound to something like 500 pf of plane capacitance and .01 uF of discrete. Generally speaking, is this too small of a buried capacitance to use? Finally, I have read that using discrete caps and buried capacitance can give more problems with respect to EMI than using each alone. Is this true? Thank you to all who respond. Tom ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu