[ibis-interconn] Re: We need to define terms System, Component, Connected, Connection, Module, .ibs Package and Die, .ibs Bare Die

  • From: "Lynne C. Green" <lgreen22@xxxxxxxxxxxxxx>
  • To: IBIS-Interconnect <ibis-interconn@xxxxxxxxxxxxx>
  • Date: Fri, 08 Feb 2013 12:21:10 -0800

All-

My usual nits, from a "newbie" viewpoint.
Where will the interconnect between bare die and package be accounted for? It is not in the IBIS [Model] or the Component [Pin] list. And apparently not in "Interconnect Subckt". Presently accounted for in [Package Model]. 

Quibbles on zero ohm impedance.
a) bare die, where wire bond is the package. Package impedance approximately 1nH, varies with wire bond length. b) bare die, flip mounted (on module or another die). Package impedance approximately 0.1nH. 
Neither case is negligible at 100Gb/sec (alpha prototyping now).
Having two definitions of "Connection" is confusing me. In simulation, a "node" means a dead short - one node number, negligible impedance, etc. While I can see the first definition, the second one is confusing me. 


Other than those nits, this is definitely clarifying things for me.

Cheers,
Lynne





On 2/8/2013 8:00 AM, Walter Katz wrote:


All,
There has been two much confusion on what EMD is and a comprehensive .ibs package and on-die interconnect solutions, so I propose the following definitions to clarify future discussions. 

System
A system consists of multiple components that have electrical connections between them. 

Component
A basic building block of a System. A component can be a backplane, PCB, Connector, Cable, DIMM component, Multi Chip Module, Interposer, package, a packaged die, a bare die, and other things that have not been invented yet. 

Connection
Two electrical nodes in a system are connected if the Insertion Loss between the two points at Nyquist is "Small". 

Connection
A connections consists of a list of electrical nodes that are all connected to each other. 

Module
A Module is a Component that has Pins that connect to other system components, and contains Components and Connections between these Components, and between these Components and the Module's Pins. 

EMD
One proposed solution that describes Interconnect Subckts between the Module Pins and/or Module Components Pins 

IBIS Component
Represented by a .ibs file, contains one, and only one die, [Models], package interconnect between the [Component] [Pins] and Die Pads, on-die interconnect between the die pads and the [Model]. 

Bare Die IBIS Component
A special case IBIS Component that represents a physical Die that is mounted directly in a Module. An example of this is a multi-chip module (MCM) that contains two are more die that are mounted and wire bonded directly on the MCM surface. The [Pin] and on-die pad are at the same location, and the Package model should be treated as a zero ohm resistor. 

Interconnect Subckt
An IBIS-ISS subckt or a Touchstone File that has ports that as described below. The ports may or may not be connected to all of the other ports. 

Module

Pins

Component Pins

IBIS Package

Pins

Die Pads

On-Die Interconnect

Die Pads

[Model] ports

Note that a Module (and therefore EMD) never has connections to [Model]!!!

Walter

Walter Katz

wkatz@xxxxxxxxxx <mailto:wkatz@xxxxxxxxxx>

Phone 303.449-2308

Mobile 303.335-6156

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