[ibis-interconn] Probe Terminals in the Interconnect BIRD

  • From: Walter Katz <wkatz@xxxxxxxxxx>
  • To: "'IBIS-Interconnect'" <ibis-interconn@xxxxxxxxxxxxx>
  • Date: Wed, 2 Dec 2015 12:15:44 -0500 (EST)

All,



One of our few remaining issues is Terminal Probes. Terminals are intended
to be connections between Pins and Die Pad, Pins and Buffers, or Die Pads
and Buffers. A Terminal Probe neither a Pin, Die Pad or Buffer. The EDA
tool is free to connect a high impedance SPICE element to generate a
waveform output in the simulation. Alternatively, the EDA tool can leave
this Terminal unconnected, or terminated to its simulator ground with a
very large resistor (e.g. 1 GigOhm).



Some of us at this week's Interconnect meeting would like to remove
Terminal Probes from the BIRD. Removing Terminal Probes will save us
week(s) of editing and review, and will require additional work by EDA
vendors who would most likely ignore them by terminating them to simulator
ground with a large resistor.



We intend to make a final decision on this in next week's meeting. If
anyone objects to this proposed decision to remove Terminal Probes from
the BIRD please either reply to this e-mail with why you want them to stay
in the specification, or to be prepared to discuss this at next
Wednesday's meeting.



Walter



Walter Katz

<mailto:wkatz@xxxxxxxxxx> wkatz@xxxxxxxxxx

Phone 303.449-2308

Mobile 303.335-6156

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