[ibis-interconn] Minutes, Feb. 6 IBIS-Interconnect Task Group and Feb. 20, 2013 Agenda
- From: "Mirmak, Michael" <michael.mirmak@xxxxxxxxx>
- To: "IBIS-Interconnect (ibis-interconn@xxxxxxxxxxxxx)" <ibis-interconn@xxxxxxxxxxxxx>
- Date: Wed, 20 Feb 2013 04:55:34 +0000
======================================================================
IBIS INTERCONNECT TASK GROUP MEETING
http://www.eda.org/ibis/interconnect_wip/
Mailing list: ibis-interconn@xxxxxxxxxxxxx<mailto:ibis-interconn@xxxxxxxxxxxxx>
======================================================================
Next meeting: Feb. 20, 2013
8 AM US Pacific Time
Agenda:
Attendance
Call for Patents
Agenda and Opens Review
Si2 Specification Status
Impact of "new BIRD" on Interconnect?
Next Meetings' Schedule/Agenda:
* Feb. 20
* Feb. 27 (?)
For international numbers, please contact Michael Mirmak.
Note: in case of issues with Lync we will use the WebEx noted at the bottom of
this message
.........................................................................................................................................
Join online meeting<https://meet.intel.com/michael.mirmak/QZ193W0C>
https://meet.intel.com/michael.mirmak/QZ193W0C
First online
meeting?<http://r.office.microsoft.com/r/rlidOC10?clid=1033&p1=4&p2=1041&pc=oc&ver=4&subver=0&bld=7185&bldver=0>
[!OC([1033])!]
.........................................................................................................................................
<--- Reservationless Bridge - Do not edit or remove ---
916-356-2663, 8-356-2663, Bridge: 2, Passcode: 8625431
Speed dialer: inteldialer://2,8625431
----------------------------------------------------------------->
Note: in case of issues with Lync we will use the WebEx noted at the bottom of
this message
======================================================================
Attendees, Feb. 6
Agilent Technologies Radek Biernacki*
Altera David Banas
ANSYS Luis Armenta*, Steve Pytel
Cadence Design Systems Brad Brim*, Ambrish Varma
Intel Michael Mirmak*
Mentor Graphics Arpad Muranyi*
Micron Technology Justin Butterfield*, Randy Wolff
QLogic Jason Zhou
Signal Integrity Software Walter Katz*
Teraspeed Consulting Group Bob Ross*
Minutes
No patents were declared.
Walter Katz requested Michael Mirmak's summary Interconnect Task Group
presentation from the Summit delivered to the team. Some concerns were raised
about stacked die in IBIS vs. in EMD. Michael presented the slides.
Brad Brim stated that the Si2 specification review should be complete by the
first week in March.
Walter noted that a list of functional requirements is the right place to
start; are we agreed on the functions we want? This is where we need closure.
- Packages
- Multi-chip modules
- Connectors
- Interposers
- Sockets
- Cables
- On-Die interconnect descriptions
Michael suggests most of these can be addressed directly with IBIS-ISS. Walter
disagreed.
EMD can address most of these independently of [Model]. EMD can deal with
multi-chip modules, connectors, interposers, sockets and cables. Michael asked
about treating sockets and/or interposers as part of the package; Walter
suggest you can do this OR separate them in EMD. This would enable using
different socket manufacturers, for example. Similarly, for interposers: one
type is between die and substrate, another is multi-chip modules (one side is
several pieces of silicon, other side is board). EMD "stands alone" - it
doesn't need to interact with [Model]. For packages, hooks/handles would
support pre-layout vs. post-layout analysis, through EMD to EMD ports or EMD
to IBIS ports.
Brad stated that, without revealing details, Si2's approach has no tie to
subcircuits. The other part of Si2 is to generate the EMD file; this is an aid
to the IC vendor to generate the EMD files. EMD defines connections between
pins of the module and pins of IBIS files, but does not define connections to
[Model]s.
Arpad Muranyi noted that BIRD116 links to [External Model] and solves some
problems but not all, including stacked die support. A revised 122 BIRD will
be issued, to cover reported technical developments between SiSoft and Agilent.
Walter replied that on-die interconnect is messy and needs discussion. Walter
objects to adding stacked-die directly in IBIS, as it's being supported in EBD
and is being extended to EMD. There's no reason to complicate IBIS files with
a stacked die treatment.
Regarding usage by IC vendors, Justin Butterfield stated that EMD looks like a
good solution, specifically for stacked die. Walter replied that IBIS history
is that IBIS files describe a single piece of silicon. Unfortunately, EBD has
"board" in it; if we wanted, we could extend it to modules, by replacing path
statements by IBIS-ISS subcircuit links and treat extended nets.
Michael asked what will happen to the current BIRDs. If BIRD 122 gets revised,
it only addresses AMI, not traditional/legacy IBIS needs.
Bob Ross noted that there are three proposals:
* BIRD 122, for AMI
* BIRD 116/117/118
* Third proposal from Arpad to do things in a different, as-yet undefined.
Walter stated that there's a need for coupling coverage (broadband, Touchstone
files). If BIRD 116 is used instead of I-V curves, it doesn't solve their
problems for non-linear clamps, etc. Arpad suggested that BIRD 145 is designed
to cascade non-linear models, if combined with BIRD116. Arpad suggested that
DDR burning needs should be addressed, short term, separate from AMI.
Bob responded that EMD could apply to legacy models, as EMD has nothing to do
with [Model]. Can [External Circuit] point to a buffer model that's non-LTI?
Arpad replied that we should be thinking of getting away from [External Model]
as a keyword. Radek Biernacki stated that, if we go for both solutions, we
should establish the rules for what solutions are used in what cases. So, the
AMI solution may override the general solution.
======================================================================
In case of Lync issues only, we will switch to WebEx as noted below.
Meeting Number: 732 940 715
Meeting Password: IBIS
-------------------------------------------------------
To join this meeting (Now from mobile devices!)
-------------------------------------------------------
1. Go to https://sisoft.webex.com/sisoft/j.php?J=732940715&PW=NNWY2NmRmZTY0
2. If requested, enter your name and email address.
3. If a password is required, enter the meeting password: IBIS
4. Click "Join".
5. Follow the instructions that appear on your screen.
-------------------------------------------------------
Audio conference information
-------------------------------------------------------
Call-in toll number (US/Canada): 1-650-479-3208
Access code:732 940 715
http://www.webex.com
IMPORTANT NOTICE: This WebEx service includes a feature that allows audio and
any documents and other materials exchanged or viewed during the session to be
recorded. By joining this session, you automatically consent to such
recordings. If you do not consent to the recording, discuss your concerns with
the meeting host prior to the start of the recording or do not join the
session. Please note that any such recordings may be subject to discovery in
the event of litigation.
Other related posts:
- » [ibis-interconn] Minutes, Feb. 6 IBIS-Interconnect Task Group and Feb. 20, 2013 Agenda - Mirmak, Michael
