Mike,
I don't like the word "nodes" in this usage. Isn't
"terminal" more appropriate for this purpose?
I like option "A" better, but even there, I don't
like "I/O" (vs. supply) terminology. I would use
"signal" instead of "I/O" vs. supply.
Thanks,
Arpad
=====================================================
From: ibis-interconn-bounce@xxxxxxxxxxxxx
[mailto:ibis-interconn-bounce@xxxxxxxxxxxxx] On Behalf Of Mirmak, Michael
Sent: Thursday, October 13, 2016 8:38 AM
To: IBIS-Interconnect (ibis-interconn@xxxxxxxxxxxxx)
<ibis-interconn@xxxxxxxxxxxxx>
Subject: [ibis-interconn] Die pads vs. die supply pads
Per yesterday's meeting discussion, a quick check of the interconnect proposal
text shows that the document is fairly consistent in using the phrase "die
pads" (usually capitalized) to refer to the physical connection point between
the on-die interconnect and the package. This point would sit between the
buffer and the pin.
However, our use of the phrase "die supply pads", particularly in the keyword
[Die Supply Pads], conflicts with this, and helps expose some fairly confusing
terminology elsewhere.
We are using the term "die pad" to distinguish it from the "pad" on a PCB where
a connection might be soldered. Further, if the three connection points are
pins, die pads and buffers, and these are being classified as I/O or supply,
then we have two ways of organizing the names to make them consistent:
Option A:
- Supply Die Pads (including the keyword, which would be renamed)
- I/O Die Pads
- Supply Pins
- I/O Pins
For buffers, the terms "Supply Buffer" and "I/O Buffer" are nonsensical even if
they are consistent. However, we are really referring to Buffer "nodes" or
connection points, so "Supply Buffer Nodes" and I/O Buffer Nodes" would seem
both consistent and reasonably clear. However, these would not get used in the
document unless we were to abandon the Buf_I/O, Ground_clamp_ref, etc.
terminology.
Option B:
- Die Supply Pads (as used for the keyword now)
- Die I/O Pads
- Component Supply Pins
- Component I/O Pins
- Buffer Supply Nodes
- Buffer I/O Nodes
Again, the latter two would not get used in the document unless we were to
abandon the Buf_I/O, Ground_clamp_ref, etc. terminology.
Is either of these options reasonable? Is there any other option?
- MM
