[edfaslonestar] EDFAS Lone Star Chapter Meeting Wednesday, September 24th
- From: Jennifer Drown <jdrown@xxxxxxxxxxxxx>
- To: <edfaslonestar@xxxxxxxxxxxxx>
- Date: Thu, 18 Sep 2014 12:14:45 -0400
Our next EDFAS Lonestar Chapter meeting is in Dallas on Wednesday, September
24th. WebEx info to follow.
Location: Omniprobe Oxford Instruments, 10410 Miller Road, Dallas TX 75238
Time: Social - 6:00pm (pizza and drink will be provided)
Technical presentation 7:00pm
Speaker: Dr. Roger J. Stierman, Process and Product Development Scientist
Title: Some Adventures in Gas Analysis for Ion-Beam-Assisted Deposition, or
³What¹s In Your Chamber?²
Presentation Abstract & Presenter Biography:
Electron beam induced deposition (EBID) and ion-beam induced deposition
(IBID) make use of gas injection of chemicals (called precursors¹) for the
beam-written construction of structures for sample manipulation (e.g.
failure analysis TEM lift-out) or IC circuit editing. This gas injection is
a controlled leak¹ into the electron/ion beam microscope, a process almost
heretical to the microscope imaging purists. The useful work that this
precursor injection allows, though, makes up for the compromises in the
beam¹s imaging provided, of course, that the chamber¹s pressure can be
kept within its specified range. During the development of Oxford
Instruments¹ OmniGIS II, a modern multi-precursor gas injector, some
interesting details in the chambers¹ environments have been observed. To
understand these phenomena, the operational methods of standard vacuum
gauges and residual gas analyzers (RGA) will be presented and compared,
along with pressure-control results from gas injection using the OmniGIS II,
and some RGA spectra of the more common precursors (for Pt, W, insulator,
and enhanced etch) will be shown & explained.
Roger received his B.S degree in Physics from Loras College, and M.S and
Ph.D. degrees in Metallurgy from Iowa State University. During his 25-year
career at Texas Instruments, his work included development of processes for
semiconductor package assembly, and characterization of semiconductor
packaging materials such as die attach, mold compounds, polymer overcoats,
wire bond and flip chip connections, flip chip underfills, and
package-to-PWB attachment. As manager of the Semiconductor Packaging Lab, he
delivered training for physical failure analysis methods including precision
cross-sectioning, SEM/EDS, X-Ray, tensile and 4-point bend testing,
microhardness, RIE/ICP etching, ion milling and laser decapsulation. He now
works at Omniprobe, an Oxford Instruments company, and intermittently
consults on semiconductor packaging failure analysis.
Other related posts:
