[tinwhiskers] Tin Whiskers papers at TMS next week in Seatlle.
- From: "Fritz, Dennis D." <DENNIS.D.FRITZ@xxxxxxxx>
- To: <tinwhiskers@xxxxxxxxxxxxx>, "(Leadfree Electronics Assembly Forum)" <Leadfree@xxxxxxx>
- Date: Tue, 9 Feb 2010 18:44:27 -0500
I have marked the whiskers papers with "**" for your convenience. The links
may work, or cut/paste the TMS address below and scroll down to the abstract
you want.
Denny
<http://www.programmaster.org/icons/ecblank.gif>
http://www.programmaster.org/PM/PM.nsf/UpcomingSymposia/61C50713356C664185257561005272BB?OpenDocument&ParentUNID=F87E0B6A42A9A9F2852574B90040FC2D
Quantitative Assessment of Microstructural Coarsening of SnAgCu Solders:
Effect of Metallization and Thermo-mechanical History
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/B14F217221A98A9585257605001E6674?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Accelerated Life Prediction
of Electrochemical Ion Migration on ENIG Surface Finish Circuit
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/F49D6F6D07908185852575F200413842?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Analysis of Simple Shear of
Lead-Free Solder Joints to Examine Heterogeneous Strain and Slip System
Activity
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/2E5373B8ABE5FC5F852575FF0002253C?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Back-Stress Induced Single
Crystal Hillock Growth in Unpassivated and Nanotwinned Copper Lines under
Electromigration at Device Operation Temperature
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/112ABBCE622C9300852575F00028B5CD?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Bending and Strain/Stress
Distribution on Flip Chips Measured by Using Synchrotron X-Ray Laue
Microdiffraction
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/23C4761B987AE3CE852575F000677137?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> **Characterization of Metal
Whisker Growth in Sn-Based Solders
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/C7E9992C4AC701898525766A002D0594?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> **Corrosion Enhanced Sn
Whisker Growth
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/060F5F9B1FFA642785257612006125FF?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Creep Property of
Sn-3Ag-0.5Cu-xNi/Au/Ni Joints after Aging
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/52C51DB610719D0A852575F20057B22C?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Critical Conditions of
Electromigration-Induced Cu Dissolution in Pb-Free Solder Joints
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/BFC873BA643E8951852575F40004BB09?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Critical Current Density of
Inhibiting the (Cu,Ni)6Sn5 Formation in the Ni-side of Cu/Solder/Ni Joints
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/535D7535D014F210852575EA002BFC42?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Cross-Interaction between Ni
and Cu across a High-Lead Solder Joint with Different Solder Volume
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/A9C82C30BD3DBE94852575EF0010E968?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Current Stressing Effect on
Intermetallic Compound Growth kinetics in Cu Pillar/Sn Bump
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/FB679C719ADA7A8A852575F2003DC0A9?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Development of Sn-Ag-Cu-X
Alloys For Electronic Assembly
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/E540D28373B531EB8525760100702A8B?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Direct Measurement of Back
Stress Un Tin Strips under Electromigration by Synchrotron Radiation X-ray
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/0271F533644CC03A852575F4004CF292?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Discussion on the Mechanism
of Electromigration Form the Perspective of Electromagnetism
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/75C22C044252141E852575F1007AF786?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Effect of Ag on the
Kirkendall Void Formation in Sn-Ag/Cu Solder Joints
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/BA973BB12659AEA085257612000DAC25?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Effect of Initial
Microstructure on Electromigration behavior of Eutectic Sn-Pb Solder Joints
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/B39F2B820F50B675852575F40070C370?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Effect of Joule Heating on
Thermo-Electromigration Induced Failure in Lead-Free Solder
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/4913478A6F230A81852576040067E150?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Effect of Minor Alloying on
the Performance of Snagcu Solder Joints under Ball Impact Test
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/7BC85DED179B9F7A852576030013D56A?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Effect of Pb Addition on
Creep and Tensile Behavior of SAC 305 Solder
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/E04F5AC60516872B8525760400744850?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Effect of Zn-containing Flux
on the Joint Strength and Microstructure of Sn-3.5Ag Soldering on an
Electroless Ni-Au Surface Finish
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/BFEC78CB59B425BE852575F2001A41BA?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Effects of Co Addition upon
Sn-8.8Zn/Cu and Sn-57Bi/Cu Interfacial Reactions
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/DE6C6064C95C69A3852575F2001038B2?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Effects of Current Density on
the Crystallographic Texture of Sn based Electrodeposited Films Containing Cu
and Pb
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/553C1A7443A8C1698525760400757E27?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Effects of Minor Ni Doping on
Interfacial Reaction and Microstructure Variation in the
Cu/Sn-3Ag-0.5Cu-xNi/Au/Ni Sandwich Structure
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/F214C854652EF09C852575F30024239C?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Effects of POSS on Impact
Behavior of Thermomechanically Fatigued Lead-Free Solder Joints
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/939B8FAE7C4F5FBD852575F400701E05?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Effects of processing and
amount of Co addition on shear strength and microstructural development in
Sn-3.0Ag-0.5Cu solder joint
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/E95347DC95C00D888525766A00089E3A?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Effects of Reinforcements
Addition on Microstructural Evolution in Eutectic SnBi Solder Joints under
Current Stressing
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/23677F0D15445933852575F3000E4DEE?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Electrochemical Corrosion
Behavior of HighTemperature Pb-free Solders
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/2AE3934B58A9655B85257602001A9FA8?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Electromigration Study of
Flip Chip Packages under Extra-high Current Density Tests with Temperature
Control
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/006EEF3E335109D1852575F4002EFF26?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Fatigue-Creep Interaction
Damage Theory Based Thermal Fatigue Life Prediction Model for SnAgCu Solder
Joints
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/084140031BBD8083852576010027ADDE?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Formation and Growth of
Intermetallic Compound (Cu6Sn5) at Early Stages in Lead-Free Soldering
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/23E4D9755801EE78852575F40055436D?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> High-Temperature Lead-Free
Solder Alternatives: Possibilities and Properties
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/142041DEADC5973B852576040029AACB?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Impact of Isothermal Aging on
Long Term Reliability of Fine Pitch Ball Grid Array Packages with Sn-Ag-Cu
Solder Interconnects
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/6AD749525AE7B9FE85257605002955D9?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Impact Testing of
Sn3.0Ag0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization after Aging at
150 C
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/F259A94BBF446CCE852575F2004CD39D?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Impression Creep of Pb
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/DFCF8B960F088F9D852575E500706DFB?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Improved Reliability of
Sn-Ag-Cu-In Solder Joint by the Addition of Trace Elements
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/A793760E399B4735852575F30029C351?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Improvement of Heat
Dissipation in High-Power Light-Emitting Diodes Using Highly Heat Conductive
Die-Attach Material
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/2805E91B5053E31C8525760500113774?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Improvement of Wettability
and Thermal Properties at Bi Based Alloys
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/6F6FC588E74B0F4A852576040020A4ED?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Influence of Interface
Reaction on Out-of-Plane Displacements During Thermal Cycling of Copper-Silicon
Bond with an Indium Interlayer
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/AC76D13DF139C0C0852576040079AC70?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Interaction between
Electromigration and Diffusionally Accommodated Interfacial Sliding at
Hetero-Interfaces
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/C95422098BE1844585257605001FB67F?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Interface Design of Lead-free
Electronic Interconnects
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/5B068A9AD3E0A3C4852575F400711D7F?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Interfacial Reaction and
Joint Reliability of Electrodes Bonded with Transverse Ultrasonic
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/B5FECB87AC88CCB28525760400394006?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Interfacial Reaction and
Microstructure Variation in the Liquid Reaction of Sn-xAg-Cu Solders on Cu-yZn
Substrates
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/5D1B3119354F82C4852575F300225572?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Interfacial Reaction between
Sn-Ag-Cu Solder and Cu Base Metal Using Laser Soldering Process
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/787D2820467CCD6E8525760200037295?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Interfacial Reactions Between
Near Eutectic Snagcu Solder Alloys and Electrolytic Au/Ni Substrates
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/CA6D6A277F17B8A5852575F4004CD5D1?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Interfacial Reactions of
Cu/Sn3.5Ag/Au Solder Joint under Electromigration
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/7EB330AB67D32676852575F30046386A?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Interfacial Reactions of
Sn3.0Ag0.5Cu Solder with Cu-Mn UBM during Aging
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/F50C4FAB6407C0B5852575F3001EEDE0?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Intermetallic Compounds and
Mechanical Properties of Sn-3Ag-0.5Cu and Sn-1Ag-0.5Cu-0.06Ni-0.01Ge Solder
Ball Grid Array Packages with ENIG Surface Finish
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/2AED0A61AD5F3255852575D8005F260A?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Internal Strain Evolution
during Thermal Cycling in a Row of Lead-Free Solder Joints in a Flip Chip Ball
Grid Array Package
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/8A7E1B1D5A86A3EC852575FE002ED6F4?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Investigating Defects in
Through-Silicon via (TSV) Chains by Three Dimensional Imaging Reconstruction
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/5CC8BABACC026305852575F2005914D0?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Investigation and Effects of
Wafer Bow in Different 3D Stacking Schemes
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/0515BFF1A7439FD6852575EC00321DF8?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Joint Strength Enhancement by
CNT Inserted Sn3.5Ag Solder Balls
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/0DB0D923AAA4474885257600000BAC8C?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Kinetics of Intermetallic
Compound Formation at the Interface between Sn-3.0Ag-0.5Cu Solder and Cu-Zn
Alloy Substrate
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/C6D52FAFD2086DDE852575F400464888?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Liquid Phase Sintered Solders
as Thermal Interface Materials for Conventional and High Temperature Electronic
Applications
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/20B4824D1011A92C85257605001BBF28?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Local Mechanical Properties
of Cu6Sn5 Intermetallics in Pb-Free Solder Joints by Microcompression Testing
of Pillars
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/219CCA8ACC23174E852575F400677506?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Mechanical Properties of
Interfacial IMCs in Solder Joints Evaluated by Nanoindentation
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/8B63097BECE90B0E85257602001C2710?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Mechanical Shock of
Environmentally-Benign Pb-Free Solders
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/F8973EAB51F1644F852575F400667909?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Mechanism of Microstructure
Evolution and Fatigue Failure in Lead Free Solder Joint
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/CA13C0AA188C570F85257604007740F5?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Microstructure and
Orientation Evolution Study on Sn-Ag-Cu Solder Joints as a Function of Position
in Ball Grid Arrays Using Orientation Image Microscopy
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/AF9928DF36D34441852575FD001C5997?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Microstructure Changes and
Physical Properties of the Intermetallic Compounds Formed at the Interface
between Sn-Cu Solders and Cu Substrate Due to Minor Additions of Alloying
Elements
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/BA194B63F0D24B938525760400750BE6?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Microstructures and Crystal
Orientation of ?-Sn for Sn-Ag and Sn-Cu Solder Joints under Electromigration
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/55B53A49134831C8852575F40048F6CC?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Microvoid Formation at
Solder-Copper Interfaces during Annealing: A Systematic Study of the Root Cause
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/A2F194F96D2EA334852576690053EC5F?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> **Mitigation of the Growth of
Tin Whiskers by Surface Treatments
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/82D71FC32D45CBEE852575F4004DE0F5?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Modeling of Pb-Free BGA
Solder Joint Fatigue Life during Random Vibration
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/7984D77E5E3747F1852575F4005D5F5B?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Modeling of Reflow
Temperatures and Wettability in Lead-free Solder Alloys using Hybrid
Evolutionary Algorithms
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/5A09A1FC5761B23B852575F3005123EE?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Nucleation and Solidification
of Sn in Pb Free, SnAgCu Solder Joints
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/8E7C0280DDDDA78D852576040075F8B9?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Observations of IMC Formation
for Au Wire Bonds to Al Pads
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/57264A69AE204632852576120062E3EA?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> On the Mechanism of Retarding
Cu3Sn Growth by Ni Addition
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/04C968CC0202D653852575F4004BBE4B?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> On The Merits of Transient
Liquid Phase Bonding as a Substitute for Soldering with High-Pb Alloys
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/5BA66C731DFF9565852575F30052C185?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Optimization of Solutions to
Electrodeposit Sn-Based Pb-Free Solders
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/75E7B76119113D0E852575F6001CE049?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Orientation Imaging Studies
of Sn3.0Ag0.5Cu Solder Joint with Various Ni Doping after Aging
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/A9963AA05A743688852575F2004E0FE8?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Pb-free Process Development
for Microcircuit Package Assemblies - A University/Industry Design Project
Collaboration
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/146CA5C3535E4643852575F40066375A?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> **Polycrystalline Sn Whisker
Growth
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/A08C1803E1483A748525766D007AA3B0?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Polymers Investigation for 3D
IC Stacking Technology
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/FF541230C3C8CE81852575F4003D706F?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Reaction between Sn and
Electroplated Cu Foils with Different Orientation
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/DA31F9C862F0990B852575F400167891?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> **Real-Time SEM/FIB Studies
of Whisker Growth and Surface Modification
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/DFA35E5BE015F2AB852575F4007AB9C9?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Reliability Evaluation of
Cu-Cored Solder Joints
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/C652CFD634DCBC5C85257602002DD9A8?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Roles of Service and
Materials Parameters on Reliability of Pb-free, Sn-based, Solder Joints
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/A38C755D2678BE37852576030052C181?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Shear and Bending Fatigue
Failure of Lead Free Solder Joint and Fracture Mechanics
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/32AFA9F6A947BB2385257604007B3337?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Shock Resistant And Thermally
Reliable Low Ag SAC Solders Doped With Mn Or Ce
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/244F179E57DFC90B8525760400517B5C?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> **Sn Whiskers and Grain
Boundary Sliding
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/8C651DDDA13D068A8525761200618022?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Solidification of the
Sn-Cu-Ag Eutectic Alloy
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/D5CA86AADF95C780852575F30014AE01?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Space: The Final Frontier for
Pb-Free Electronics?
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/BABF26887C90C442852575F400484A95?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Study of Emerging New
Interconnect Methods: How Far SMT Will Go
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/CAC374B7071BA0CA85257604006C90E0?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Study of Joule Heating
Effects in Lead-Free Solder Joints under Various Current Densities Using
Infrared Thermography
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/C93445377CCC0968852575F3001D1C76?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Study of the Impact
Performance of Solder Joints by High-Velocity Impact Tests
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/02EF99A8EE1231BE852575F200376974?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Study of UBM Consumption in
Flip Chip Solder Joints with Local Temperature Control
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/036D87AA4B8FEDD7852576050014C215?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Study on Paste Printing for
Electronics
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/383BA84E2E3E5C6885257604007419E6?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> Synchrotron Microdiffraction
Study of Localized Stress and Surface Evolution in Sn-Cu System
<http://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/4C7BF37BB34DA304852575F5000B6142?OpenDocument>
<http://www.programmaster.org/icons/ecblank.gif> TEM Characterization of the
Porous Structure Induced by High Current Density in the Flip-Chip Solder Joint
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