[tinwhiskers] SMT Article looking for Industry Partners
- From: Frank Simpson <FSimpson@xxxxxxxxxxx>
- To: tinwhiskers@xxxxxxxxxxxxx
- Date: Thu, 19 Mar 2009 10:37:26 -0700
Howdy all,
Article based on "Tin Whiskers" (FYI). Also mentioned at the end,
"Industry Partners Wanted". Thought there might be some takers in this
email forum we have going.
Regards,
fs
Link:
http://smt.pennnet.com/display_article/356507/35/ARTCL/none/none/1/Scientists-Research-Tin-Pest-and-Whiskers/?pc=ENL
Surface Mount Technology Online Article
Click here to enlarge image
The transformation of tin progresses R to L. Normal tin is at top right of
the image; transformed tin at the bottom left.
| Add RSS Feed
Scientists Research Tin Pest and Whiskers
(March 17, 2009) LONDON — Scientists at the National Physical Laboratory
(NPL) in the U.K. will begin research on lead-free solder alloys,
specifically how dangerous tin pest and tin whiskers affect lead-free
assemblies. NPL received funding from BERR and is looking for industry
partners in the research.
NPL has been using its expertise in the area of studying the allotropic
phase transformation in tin and its alloys, commonly known as tin pest, to
measure the implications of adopting lead-free solder manufacturing
practices. NPL just received funding from the Department for Business,
Enterprise & Regulatory Reform (BERR). It is committed to co-fund this
work with industry support and has allocated a significant budget over a
two-year period to research the problem of tin pest. NPL are looking for
further industrial partners and are keen to hear from interested folk.
Tin pest, or the allotropic phase transformation in tin and its alloys,
can decompose tin into powder at low temperatures. Tin pest was thought to
be a problem of the past as tin/lead alloys did not suffer the same
effect; however, the Restriction of Hazardous Substances Directive (RoHS)
brought back the problem, as lead-free alloys contain 95% to 99% tin. Tin
pest could dangerously affect the safety and functionality of electronic
products used across many manufacturing sectors, such as the avionics
industry.
RoHS has also seen electronics component manufacturers moving to pure tin
component termination finishes. These are prone to the spontaneous growth
of tin whiskers, which can cause catastrophic failures in electronic
circuits. Reported failures include the loss of at least two
communications satellites and the unplanned shutdown of a nuclear reactor.
It has been suggested that conformal coatings (materials applied in thin
layers, often by dipping, spraying or flow coating) can be used to inhibit
whisker growth.
NPL has developed a new measurement system and test method to assess the
ability of different conformal coatings to stop or slow down tin whisker
growth. The method also can help conformal coating developers to modify
their coatings to inhibit whisker initiation, growth, and penetration for
electronic circuits.
Chris Hunt, Ph.D., NPL, said that the group is looking for 15 industry
partners to share in the project. Hunt can be contacted at
chris.hunt@xxxxxxxxx; 0208 943 7027.
Regards,
Frank Simpson
Component Engineer / Document Control
XP Power, Inc.
990 Benecia Avenue
Sunnyvale, California 94085
fsimpson@xxxxxxxxxxx
Direct (408)-524-8591
FAX (408)-522-9989
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
PRIVACY & CONFIDENTIALITY NOTICE: The information contained in this
e-mail and any attachments is intended for the named recipient(s) only,
unless otherwise waived in writing by me. It may contain privileged and
confidential information. If you are not the intended recipient, you
must not copy, forward or distribute. If you have received this e-mail
in error, please notify me immediately.
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Other related posts:
