[TechAssist] Re: Heat disssipation question
- From: "OrpheusComputing.com Repair" <techassist@xxxxxxxxxxxxxxxxxxxx>
- To: <techassist@xxxxxxxxxxxxx>
- Date: Fri, 8 Feb 2002 05:36:25 -0600
It depends on what exactly the components involved are. If a
clip is used (like in the case of a CPU), a thermal pad is
best. If no attaching device is used, and it will be
permanent, thermal epoxy is best (something like "Arctic
Silver"). Heat sink compound is not good because it can dry
out and shrink.
-Clint
God Bless Us All
Clint Hamilton, Owner
http://OrpheusComputing.com
http://ComputerHardware-ConsumerElectronics.com
sales@xxxxxxxxxxxxxxxxxxxx
Fax: 209-882-9602
TechAssist Administration
http://tech-assist.org
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4orpheus@xxxxxxxxxxxxx (alternates)
orpheuscomputing@xxxxxxxxx
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if replying to this email!!)
----- Original Message -----
From: "Ron Miller" <rlmbkm@xxxxxxxx>
To: <techassist@xxxxxxxxxxxxx>
Sent: Thursday, February 07, 2002 2:40 PM
Subject: [TechAssist] Heat disssipation question
What works best: heatsink compound or the white tape
type,like Sony
uses,transfers heat better?
Ron Miller
D.T.V. Texas
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